Matsushita Electric Industrial Co., Ltd.

Matsushita Electrical Industrial Co., Ltd.

Makito Seno

Yoshihiko Misawa

Kunio Sakurai

Hiroshi Ota

Yuzo Nishimori

Yasuyuki Ishitani

Kanji Hata

Kurayasu Hamasaki

Shigetoshi Negishi

Yoshiyuki Nagai

Masato Tanino

Shiro Oji

Susumu Takaichi

Akiko Katsui

Kenichi Sato

Takeshi Okada

Wataru Hirai

Yoshinobu Maeda

Ken Takano

Muneyoshi Fujiwara

Takao Kashiwazaki

Hirokazu Honkawa

Seiichi Mogi

Hironori Konno

Motoshi Shitanda

Koji Fujiwara

Takao Eguchi

Koichi Morita

Makoto Kawai

Makoto Nakashima

Tsutomu Inukai

Koichi Yasunaga

Kengi Fukumoto

Toshiaki Sugimura

Kiyoshi Tomita

Sugio Morito

The present invention has for its object to provide an apparatus and a method for transferring boards, and a component mounting apparatus whereby a production efficiency can be improved in accordance with types of boards to be produced. For accomplishing this object, there are arranged a shift device capable of moving a mounted board from a process-finished board transfer path to an unprocessed board transfer path, a controller for controlling this moving, and an identifying device. This arrangement enables switching of a method of transferring boards in accordance with types of boards to be produced, and controlling supply of boards to the component mounting apparatus, so that production efficiency is improved in accordance with types of boards.

Board transferring apparatus including identifying devices, and component mounting apparatus including the board transferring apparatus

Board transfer apparatus, board transfer method, and component mounting apparatus

A plurality of self-propelled system heads ( ) are made to independently travel along a closed-loop travel track ( ) in a manner that the heads do not interfere with each other by controlling respective drive devices ( ). Components ( ) from a component supply device ( ) are held by component holding members ( ) of the heads, and thereafter, the components held by the component holding members are mounted on boards ( ) positioned by board positioning devices ( ).

Method and apparatus for mounting component

A device for mounting components using mounting heads having a plurality of suction nozzles that provide a plurality of component pickups, positions or mounting operating positions. The mounting heads are positioned on a rotating table that is cooperatively positioned adjacent a component supply table having a plurality of component feeder members. The control unit can rotate the rotating table to position a mounting head at a component supply position and further position one of the plurality of suction nozzles to a first, second and third section operating position for picking up a component from a component feeder. The relative movement of the component supply table and the positioning of first and second suction operating positions relative to our reference point where the edge of the rotating table contacts the line of movement of the component supply table can increase the pickup speed of components.

Device for mounting components

When a movable member ( ) is moved from a gripping position in which a circuit board ( ) was gripped by the movable member ( ) and a stationary member ( ), a separation mechanism ( ) forcibly separates the circuit board from the stationary member ( ), to thereby prevent the occurrence of a state in which the circuit board ( ) is stuck to the stationary member.

Circuit board holding apparatus and circuit board hold releasing method

A component feed apparatus includes a first feed table (,) loaded with a plurality of component feed cassettes (,) thereon and moving in a manner so that the first feed table can be positioned in a right-left direction as an arrangement direction of the component feed cassettes. A second feed table (,) is located at the rear of the first feed table and is loaded and arranged with a plurality of component feed cassettes (,) in the right-left direction. Also, a component transfer unit (,) which is located at the lateral side of the first feed table and moves so that the component transfer unit can be positioned in the right-left direction, thereby receiving components from the component feed cassettes on the second feed table and sending the components forward.

Part supplying device and method for supplying parts using the same device

When a movable member (,) is moved from a gripping position in which a circuit board (,) was gripped by the movable member (,) and a stationary member (,), a separation mechanism (,) forcibly separates the circuit board from the stationary member (,), to thereby prevent the occurrence of a state in which the circuit board (,) is stuck to the stationary member.

Circuit board holding apparatus

A method for mounting components using mounting heads for which a plurality of suction or mounting operating positions are set for suction nozzles in a state where the mounting head is at rest in a component supply position or component mounting position, it being possible to select any of these operating positions, comprising a first step of selecting a component supply position or component mounting position such that the amount of movement of component feeder holding components to be mounted, or the amount of movement of the substrate to the mounting position for the next component to be mounted becomes a minimum, and moving the component feeder or substrate accordingly; and a second step of selecting a suction nozzle position corresponding to the component suction position or component mounting position in the first step, whilst the mounting head is moving towards the component suction position.

Method for mounting component

Printed circuit board positioning device

Method and apparatus for selecting acceleration or deceleration of a

Part supply apparatus

Method and apparatus for mounting components

A component mounting apparatus which comprises at least first and second component supply assemblies mounted on respective movable tables that are mounted on a common track for movement therealong. The apparatus also comprises at least one positioning device for positioning a printed circuit board on which components are desired to be mounted; at least one component mounting unit for receiving a component at a predetermined position of the component supply assembly and mounting the component onto the support member; and a table moving mechanism which is selectively connectable with one of the first and second movable tables for driving the movable table along the common track. The table moving mechanism comprises a fixed shaft member disposed laterally of and extending parallel to the common track, a drive unit mounted on the fixed shaft member for movement therealong between opposite ends of the fixed shaft member, and a releasable coupling for selectively connecting and disconnecting the drive unit with and from any one of the movable tables, respectively.

Electric component mounting apparatus

A component mounting method, and an apparatus therefor, which includes the steps of causing a plurality of suction nozzles, supported for intermittent movement along a predetermined path in synchronism with each other, to receive electric components at a component receiving station and then to transport them towards a component mounting station, and effecting both the rectification of the position of each component in two directions perpendicular to each other and the angle adjustment of the respective component during the successive transportation of the components towards the component mounting station. Both the rectification of the position and the angle adjustment of each component are carried out while the associated suction nozzle is held still at a certain station, and electric characteristics of each component are checked during the rectification.

Method of and apparatus for mounting electric components

In an electronic chip placement machine with test function, there is provided a suction nozzle for holding a chip, a chip-regulation device for regulating the attitude of the chip by clamping the chip at portions having no electrodes probes for testing electrical characteristics of the chip. The tip portion of the suction nozzle is made of an insulating material such as a ceramic or a synthetic resin in order to avoid a short-circuit between electrodes of the chip through the nozzle. Therefore, the electrical characteristics of the chip can be tested without the separation between the nozzle and the chip. Furthermore, since one cycle of the operational process according to the present invention is shorter than that of the conventional operational process, it is possible to provide chip-test and placement machines whose structure is simple. As a result, productivity and durability can also be increased.

Chip-placement machine with test function

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Hirakata, Japan

Makito Seno