Hitachi, Ltd.

Makio Watanabe

Hiroshi Kikuchi

Hitoshi Oka

Isamu Tanaka

Shinichiro Imabayashi

Masaaki Sato

Aizo Kaneda

Yoshihide Yamaguchi

Hisashi Sugiyama

Naoya Kitamura

Hideyasu Murooka

Ryoji Iwamura

Masayuki Kyoui

Shigeru Fujita

Yukihiro Taniguti

Reiko Yano

Yukihiro Taniguchi

A multilayer wiring board fabricating method and a multilayer wiring board fabricated with use of the method that a solvent-free fluid polymer precursor is put on a wiring layer of a base substrate, and space among the wirings is exhausted and is filled with the precursor, and the precursor is hardened under a hydrostatic pressure and then the next wiring layer is formed before the above process is repeated one or more times. The multilayer wiring board fabricating method is excellent in the mass productivity and low cost and in that the wiring can be made highly dense with the substrate having vertical via conductors for connection among the conductor layers.

Multilayer wiring board fabricating method

A resin composition for forming conductor patterns comprising a photo curable resin, a photopolymerization initiator, a thermosetting resin, agent for the thermosetting resin, photosensitive semiconductor particles, and if necessary a polyfunctional unsaturated compound is suitable for forming very fine conductor patterns in a build-up method.

Photosensitive resin composition for forming conductor patterns and

A printed circuit board has a resist layer made from a photo-setting resist composition containing:

Photo-setting resist composition, a process for producing a printed

A photo curable diallyl phthalate resin composition characterized by containing 0.1 to 10 parts by weight of an agent for preventing back side undesirable curing and 20 to 100 parts by weight of a filler per 100 parts by weight of a diallyl phthalate prepolymer is particularly suitable for a partly additive process for forming a solder resist effective for preventing back side undesirable curing by ultraviolet light and having resistance to release of substances from the solder resist for deteriorating properties of plated copper film as well as for giving good mechanical properties.

Photocurable diallyl phthalate resin composition and printed circuit

A plastic information-recording medium comprises a pair of juxtaposed transparent plastic substrates molded from a composition, which is comprised of a copolymer consisting of 5 to 25% by weight of acrylonitrile or methacrylonitrile and 95 to 75% by weight of at least one of other monomers copolymerizable with acrylonitrile or methacrylonitrile than styrene or a styrene derivative, or a composition comprising at least 70% by weight of the copolymer and at most 30% by weight of butadiene rubber, and has a clearance between the substrates, the clearance being gas-tightly blocked from an outside atmosphere by joining the substrates together at peripheral edges thereof, and a recording film being provided on each of clearance-facing sides of the substrates.

Plastic information-recording medium

Growing community of inventors

Fujisawa, Japan

Makio Watanabe