Tanaka Kikinzoku Kogyo K.k.

Kabushiki Kaisha Nihon Micronics

Maki Watanabe

Kazuya Goto

Takeshi Kondo

Toshinori Omori

Shintaro Abe

Takashi Akiniwa

Takeki Sugisawa

Yasuaki Osanai

An object is to enhance the durability of substrates of a probe substrate and/or the probe substrate and a member to be joined. A probe substrate according to the present disclosure includes: a plurality of electrical contactors respectively brought into electrical contact with a plurality of electrode terminals of a member to be inspected, a joint portion for a member to be joined is provided on one or each of a first surface and a second surface of the probe substrate and the member to be joined is joined to the joint portion with a metal layer that includes, in a metal component, at least 70 atomic percent or more of a transition metal and that is formed by sintering, and/or in a joining surface between a plurality of substrates of the probe substrate, the substrates are joined together with the metal layer formed by sintering, in the metal layer formed by sintering, a plurality of organic component parts and/or voids formed by heating an adhesive composition including a thermoplastic resin are left and the organic component parts and/or the voids included in the metal layer formed by sintering have 5 to 80 area percent in a vertical cross section of the metal layer formed by sintering.

Probe substrate and electrical connecting apparatus

Growing community of inventors

Kanagawa, Japan

Maki Watanabe