Panasonic Intellectual Property Management Co., Ltd.

Panasonic Corporation

Nippon Sheet Glass Company, Limited

Paansonic Corporation

Maki Nakamura

Suguru Fujita

Kaoru Ishida

Shigeru Morimoto

Yuichi Kashino

Junji Sato

Ryosuke Shiozaki

Etsuo Ogino

Toshiaki Anzaki

Hiroyuki Uno

Toshiaki Mizuno

Kentaro Watanabe

A radio-frequency module includes: boards; interconnect parts that are conductor layers on the individual boards, at least one of the conductor layers being connected to an RF chip; a land that is a conductor layer connected to one of the interconnect parts; a transmission unit disposed between the boards, connected to the boards through the land to transmit a signal; a ground conductor disposed around the land and the interconnect part connected to the land; an isolation part disposed between the interconnect layer connected to the land and the ground conductor to isolate the interconnect layer connected to the land from the ground conductor; and a coupling part disposed between the land and the ground conductor to short-circuit the land and the ground conductor.

Radio-frequency module

An antenna device includes a dielectric substrate, a conductor plate that is placed on one surface of the dielectric substrate, that includes a first slot element, a second slot element, and one or more slits, and a ground conductor that is placed at a specified distance from the conductor plate in a first direction. A center of the first slot element is placed between a center of the second slot element and a center of each of slits, in a second direction.

Antenna device

A wireless device includes an antenna that has a planar shape and radiates a radio signal toward another wireless device, and a chassis housing the antenna and having an outer peripheral portion placed to face the antenna. Multiple distances between a surface of the outer peripheral portion and the antenna are non-uniform.

Wireless device and wireless system

An antenna device includes a wireless module, a module substrate, and a metal plate. The wireless module includes an antenna element that operates in a millimeter wave band. The module substrate is a multi-layer wiring module substrate on which the wireless module is mounted. The metal plate has a length of 1/10 or more of an operation wavelength and is positioned in a vertical direction relative to a plane surface of the antenna element and in a predetermined distance from the antenna element.

A microwave circuit with which cracks in substrates can be suppressed and which can reduce the size of module including the microwave circuit is provided. The microwave circuit includes a multilayer first substrate, a second substrate that opposes the first substrate, a plurality of first electrically conductive members that electrically connect a first layer of the first substrate and the second substrate to each other, a plurality of second electrically conductive members that electrically connect the first layer of the first substrate and another layer of the first substrate to each other and each of the plurality of second electrically conductive members has a smaller diameter than that of each of the first electrically conductive members, and transmission lines that connect the first electrically conductive members and the second electrically conductive members. In the microwave circuit, the plurality of first electrically conductive members and the plurality of second electrically conductive members are alternately disposed along an end portion of the first substrate.

Microwave circuit

Provided is a wireless module whose size can be made smaller. The wireless module includes: a first substrate on which an antenna is mounted; a second substrate which opposes the first substrate and on which an electronic component is mounted; and a plurality of electric conductors which connect the first substrate and the second substrate and which transmit a signal between the antenna and the electronic components, wherein the plurality of electric conductors are disposed between the first substrate and the second substrate in series in a substantially vertical direction with respect to mounting surfaces of the first substrate and the second substrate.

Wireless module and production method for wireless module

A semiconductor package includes a first substrate including a first surface layer where a first pad region and a second pad region are formed, the first pad region including a plurality of first pads for connection to a first IC, the second pad region including a plurality of second pads for connection to a second substrate, and a second surface layer where a third pad region including a plurality of third pads for connection to a second IC is formed, the second surface layer being formed on an opposite side of the first surface layer. The second pads surround the first pad region in at least three rows, and one or more pads included in the second pads and arranged in an inner portion are connected to one or more pads included in the first pads and to one or more pads included in the third pads.

Semiconductor package and semiconductor device

A polar modulator of the present invention includes: a first function block which generates an amplitude signal and a phase signal; a second function block which adjusts the signal delay between the amplitude signal and the phase signal; a third function block which allows the low frequency component of the amplitude signal to pass therethrough; a fourth function block which modulates the phase of the phase signal; a fifth function block which outputs a modulation voltage, based on the amplitude signal; a sixth function block which modulates the amplitude of the phase signal, based on the modulation voltage; a seventh function block which measures the temperature of at least one function block; and an eighth function block which calculates a compensation amount for the signal delay, based on the measured temperature. The second function block adjusts the signal delay, based on the compensation amount.

Polar modulator

Disclosed is a polar modulation transmission circuit wherein distortion components resulting from variations between individual amplifiers are compensated for with few man-hours, and deterioration in signal quality is effectively suppressed. A frequency converter () converts the frequency of an output signal of a high frequency power amplifier () and outputs a frequency domain signal, and a phase compensation unit () measures the power level, for each delay amount, at a low frequency band and high frequency band wherein the detuning frequency from the frequency domain signal is the same, calculates the 'unlevel amount' (relative level difference) between the power level of the low frequency band and power level of the high frequency band for each delay amount, and determines the compensation characteristics on the basis of the relationship of the unlevel amount (relative level difference) to the delay amount. Then, the phase compensation unit () compensates for the phase signal by adding to the phase signal the phase compensation amount, in the determined compensation characteristics, that corresponds to the amplitude signal.

Polar modulation transmission circuit and polar modulation transmission method

Provided is a transmission circuit capable of compensating a variation in output power caused due to a temperature change or an individual variability when the operation mode is switched without an increase in the size of the transmission circuit which switches the operation mode between a linear operation mode and a nonlinear operation mode, and capable of suppressing the deterioration of the quality of a transmission signal. In the transmission circuit, a gain setting section () sets the gain (target gain) of a variable gain amplifier (), to a value which enables the variable gain amplifier () to operate linearly and corresponds to a comparison result (output error level) obtained through comparison between the target level of the variable gain amplifier () corresponding to the set power level of the transmission signal and the power level of an output signal of the variable gain amplifier () detected by a power detection section (). The variable gain amplifier () amplifies an amplitude phase modulation signal or a phase modulation signal (phase path signal) in accordance with the target gain set by the gain setting section ().

Transmission circuit and transmission method

The polar modulation apparatus of the present invention can control the output power of a transmission signal over a wide range and compensate characteristic degradation reliably upon temperature change. Polar modulation transmission apparatusis provided with: temperature sensor; temperature compensation section-that corrects an amplitude signal and performs temperature compensation for transmission power amplification section; temperature compensation section-that corrects a power amplification signal and performs temperature compensation for power adjustment section; and correction value setting sectionthat sets correction values for temperature compensation section-and temperature compensation section-, and, while only the amplitude signal is corrected according to a measurement result in temperature sensorin the first mode, the amplitude signal and the power adjustment signal are corrected according to a measurement result in the second mode.

Polar modulation transmission apparatus and polar modulation transmission method

A polar modulation transmission apparatus is disclosed, which reduces the circuit scale by removing isolators and which reduces the heat loss of a power amplifier. In this apparatus, current detecting sectiondetects current value Icc of current flowing from power supply voltage sectionto power amplifier, and power control sectionoutputs control signal Sto power apply sectionbased on power control signal Sto be inputted and current value Icc. Power apply sectionforms amplitude modulation signal Sby multiplying baseband amplitude modulation signal Sby control signal S, and regulatorsupplies to power amplifierpower supply voltage Sconverted into power supply voltage Sby amplitude modulation signal S. Power amplifierobtains RF transmission signal Sby amplifying the power of phase modulation high-frequency signal Sas the power supply of power supply voltage S

Polar modulation transmission apparatus

Provided is a polar modulation apparatus capable of performing power limit with a simple configuration even when controlling a transmission power and increasing the transmission signal output power control range. A polar modulation device () includes an amplitude limit unit () for limiting an amplitude component of an amplitude signal, a D/A converter () for converting an inputted digital signal into an analog signal, a power control unit () for performing power control so that the inputted signal is an output signal based on the power control signal, a voltage control circuit () for supplying voltage to an amplitude modulator () according to the output signal from the power control unit (), an angle modulator () for performing angle modulation according to a phase signal, and an amplitude modulator () for performing amplitude modulation on the signal subjected to angle modulation, according to the voltage supplied from the voltage control circuit ().

Polar modulation apparatus

A method of manufacturing a substrate for displays is provided, which can easily control the surface electrical resistance of the anti-electrification film formed on a surface of the substrate, and a substrate for displays manufactured by the same method. The film is formed by preparing a target from a metal oxide, and forming a thin film of a metal oxynitride on a surface of the substrate by sputtering using the target in an atmosphere of a mixture gas of an inert gas and nitrogen, a mixing ratio of the inert gas and nitrogen in the atmosphere being adjusted such that the thin film has a desired surface electrical resistance.

Growing community of inventors

Osaka, Japan

Maki Nakamura