Dow Corning Corporation

Dow Corning Toray Company, Ltd.

Dow Toray Co., Ltd.

Dow Silicones Corporation

Itn Energy Systems, Inc.

Maki Itoh

Michitaka Suto

Dimitris Katsoulis

Yukinari Harimoto

Akihiro Nakamura

Haruhiko Furukawa

Bizhong Zhu

Nobuo Kushibiki

Masaaki Amako

Thomas Duncan Barnard

Takeaki Tsuda

Haruna Mizuno

Randall Gene Schmidt

Tomohiro Iimura

Nanguo Liu

Akito Hayashi

Joseph H Armstrong

Lawrence M Woods

Shawn K Mealey

Takashi Sagawa

Herschel Henry Reese

Hidekatsu Hatanaka

Katsuya Eguchi

Gunn Jo

Rosine M Ribelin

Nicole Anderson

Hojin Choi

Jina Chon

Min-Hee Kwon

Jeonggi Kim

Sunny Kim

A curable organopolysiloxane composition is provided which forms a pressure sensitive adhesive (PSA) layer capable of a wide range of storage elastic modulus (G') at low temperatures, and with excellent curability and adhesion. A PSA layer-forming organopolysiloxane composition comprises: (A) a chain organopolysiloxane having alkenyl groups; (B) an organopolysiloxane resin which has a content of 9 moles or less of hydroxyl groups and the like and is a mixture of (b1) an organopolysiloxane resin having a weight average molecular weight (Mw) of 4500 or more and (b2) an organopolysiloxane resin having a Mw of less than 4500; (C) an organohydrogenpolysiloxane; and (D) a hydrosilylation reaction catalyst. The mass ratio of component (B) to component (A) is within a range of 0.9 to 3.0, and the shear storage elastic modulus G′ at −20° C. of a PSA layer obtained by curing the composition is within a range of 0.77 to 50.00 MPa.

Organopolysiloxane composition for forming pressure sensitive adhesive layer, and use of same

A curable organopolysiloxane composition is provided which forms a pressure sensitive adhesive (PSA) layer having a relatively low storage elastic modulus (G') at low temperatures, excellent curability, and sufficient adhesion for practical use. A PSA layer-forming organopolysiloxane composition comprises: (A) a chain organopolysiloxane having alkenyl groups; (B) an organopolysiloxane resin which has a content of 9 moles or less of hydroxyl groups and the like is a mixture of (b1) an organopolysiloxane resin having a weight average molecular weight (Mw) of 4500 or more and (b2) an organopolysiloxane resin having a Mw of less than 4500; (C) an organohydrogenpolysiloxane; and (D) a hydrosilylation reaction catalyst. The mass ratio of component (B) to component (A) is within a range of 0.9 to 2.0, and the shear storage elastic modulus G′ at −20° C. of a PSA layer obtained by curing the composition is within a range of 0.01 to 0.75 MPa.

A curable organopolysiloxane composition is provided which forms a pressure sensitive adhesive (PSA) layer having a low storage elastic modulus (G′), excellent curability, and sufficient adhesion, along with applications thereof. A PSA layer-forming organopolysiloxane composition comprises: (A) a chain organopolysiloxane having alkenyl groups; (B) an organopolysiloxane resin wherein the weight average molecular weight (Mw) thereof is less than 4500 and the sum of the content of hydroxyl groups, etc. is 9 mole % or less; (C) an organohydrogenpolysiloxane; and (D) a hydrosilylation reaction catalyst; and optionally, (A′) a chain organopolysiloxane which does not contain a carbon-carbon double bond-containing reactive group in the molecule. The mass ratio of the organopolysiloxane resin (B) to the chain organopolysiloxane (A) is within a specific range and the shear storage elastic modulus G′ at −20° C. of a PSA layer obtained by curing the composition is within a range of 0.01 to 1.0 MPa.

A flexible laminate, in which it is possible to achieve both flexibility and durability, is disclosed. A flexible display using the flexible laminate is also disclosed. The flexible laminate includes one or more units of a laminate structure in which two hard layers interposing one or more intermediate layers therebetween are bonded together as one unit. The intermediate layer has viscoelasticity. When the flexible laminate is bent, a neutral plane is formed in each inner portion of the hard layers that are bonded together to interpose the intermediate layer therebetween.

Flexible laminate having viscoelasticity and flexible display using same

A flexible laminate for which increased flexibility and improved durability can coexist, and a flexible display provided with same, are disclosed. The flexible laminate has at least one unit of a laminated structure in which two hard layers closely adhere to each other with at least one intermediate layer therebetween. When the flexible laminate is bent, neutral planes are formed inside each of the hard layers that closely adhere to each other with the intermediate layer therebetween. The flexible laminate satisfies the following expression: a&#xd7;ln(tan &#x3b4;&#xd7;E/0.01)&#x2265;100. In the expression, a is any value ranging from 200 to 2,000, tan &#x3b4; represents a loss factor for a substance configuring the intermediate layer, and Erepresents an elastic modulus (MPa) of the substance configuring the intermediate layer.

Flexible laminate and flexible display provided with same

The present invention relates to a curable silicone composition comprising: (A) an organopolysiloxane represented by the average unit formula: (RSiO)(RSiO)(RSiO)(RSiO), wherein, Rare the same or different alkyl groups having from 1 to 12 carbons, alkenyl groups having from 2 to 12 carbons, aryl groups having from 6 to 20 carbons, or aralkyl groups having from 7 to 20 carbons, provided that at least two Rin a molecule are the alkenyl groups; Ris an aryl group having from 6 to 20 carbons or an aralkyl group having from 7 to 20 carbons; Ris an alkyl group having from 1 to 12 carbons; and a, b, c, and d are respectively numbers satisfying: 0.01&#x2266;a&#x2266;0.5, 0&#x2266;b&#x2266;0.7, 0.01&#x2266;c&#x3c;0.7, 0.1&#x2266;d&#x3c;0.9, and a+b+c+d=1; (B) a linear organopolysiloxane having at least two silicon-bonded alkenyl groups and at least one silicon-bonded aryl group in a molecule; (C) an organopolysiloxane having at least two silicon-bonded hydrogen atoms in a molecule; (D) a hydrosilylation-reaction catalyst. The curable silicone composition has excellent handling/workability and forming a cured product with a high refractive index and low gas permeability when cured.

Curable silicone composition, cured product thereof, and optical semiconductor device

The present invention relates to a curable silicone composition comprising: (A) an organopolysiloxane having at least two alkenyl groups in a molecule; (B) an organopolysiloxane represented by a general formula; (C) an organopolysiloxane having at least two silicon-bonded hydrogen atoms in a molecule; (D) a phosphor; and (E) a hydrosilylation reaction catalyst, to a cured product obtained by curing said composition, and to an optical semiconductor device in which a light emitting element is sealed or coated with a cured product of the aforementioned composition. The curable silicone composition has excellent fluidity and cures to form a cured product in which phosphors are homogeneously dispersed and which has a high refractive index.

Polyheterosiloxane compositions are disclosed containing at least 70% by weight of the following components: (A) a first metal (M1) selected from Ti, Zr, or Zn, (B) a second metal (M2) selected from a non-lanthanide metal, (C) siloxy units having the formula RSiOor R'SiO, where R&#x2032; is independently a hydrocarbon group or halogen substituted hydrocarbon group containing 1 to 18 carbon atoms. The disclosed compositions are useful to prepare high refractive index materials.

Polyheterosilxoanes for high refractive index materials

A curable liquid composition obtained by subjecting hydrogen halosiloxane or hydrogen alkoxysilane to condensation or to hydrolysis and condensation in an organic solvent in which fine polyvalent metal oxide particles with hydroxyl groups are dispersed; a method of forming a hard silica-type layer by applying onto an inorganic substrate the aforementioned composition and then curing the composition; an inorganic substrate with the aforementioned hard silica-type layer; and a semiconductor device comprising the aforementioned inorganic substrate on which a semiconductor layer is formed.

Curable liquid composition, method of coating, inorganic substrate, and semiconductor device

An article of manufacture comprising (i) at least one metal foil substrate; (ii) a coating layer on at least a portion of at least one side of the metal foil substrate wherein the coating layer comprises (a) a condensation cured silicone resin composition and (b) silica nanoparticles.

Metal foil substrates coated with condensation cured silicone resin compositions

A method of manufacturing an inorganic substrate coated with a thin silica type glass layer of 2H to 9H pencil hardness, said method comprising the steps of: coating an inorganic substrate with a cyclic dihydrogenpolysiloxane and/or a hydrogenpolysiloxane represented by a specific unit formula, and curing it; an inorganic substrate coated with a thin silica type glass layer; a coating agent for an inorganic substrate that is composed of a cyclic dihydrogenpolysiloxane and/or a hydrogenpolysiloxane represented by a specific unit formula; and a semiconductor device having an inorganic substrate coated with a thin silica type glass layer.

Inorganic substrate with a thin silica type glass layer, method of manufacturing the aforementioned substrate, coating agent, and a semiconductor device

In an embodiment, one reinforced substrate for use in a photovoltaic device includes a polymer base material and a reinforcing structure bonded with the base material. The reinforced substrate presents a surface in a condition that is made-ready for deposition of thin film layers of the photovoltaic device. A thin film photovoltaic device includes the reinforced substrate, a back contact layer formed on the surface of the reinforced substrate, and a solar absorber layer formed on the back contact layer. A plurality of thin film photovoltaic devices may be formed on a common reinforced substrate. A process of producing a reinforced substrate includes combining a fluid base material and a fiber reinforcing structure to form an impregnated fiber reinforcement. The impregnated fiber reinforcement is cured to form the reinforced substrate, and the reinforced substrate is annealed.

Reinforcing structures for thin-film photovoltaic device substrates, and associated methods

Cyclic dihydrogenpolysiloxanes, hydrogenpolysiloxanes of specific siloxane unit formulas etc., a process for their production using hydrolysis/condensation, a process for the production of silica type glass moldings with an optical transmittance of 90% to 100% in the vacuum-UV region to UV region and an optical transmittance of 98% to 100% in the visible region to near infrared region by curing said cyclic dihydrogensiloxanes or said hydrogenpolysiloxanes in a mold, said silica type glass moldings, optical elements made up of the silica type glass, a process for the production of optical elements having such a silica type glass film layer by coating an optical element with the hydrogenpolysiloxanes and curing them, and optical elements having such a silica type glass film layer.

Cyclic dihydrogenpolysiloxanes, hydrogenpolysiloxanes, processes for their production, silica type glass moldings and a process for their production, optical elements and a process for their production

A free-standing film comprising a cured organopolysiloxane resin obtained by conducting a cross-linking reaction between (A) an organopolysiloxane resin represented by the following average siloxane unit formula: [RRSiO][RSiO](1) or [RRSiO][RSiO][SiO](2) (where Rdesignates univalent hydrocarbon groups of one or more than one type selected from alkyl groups having 1 to 4 carbon atoms and univalent aromatic hydrocarbon groups having 6 to 8 carbon atoms; Rdesignate alkenyl groups having 2 to 6 carbon atoms; Rdesignates alkyl groups with 1 to 4 carbon atoms or univalent aromatic hydrocarbon groups having 6 to 8 carbon atoms; at least 50 mole % of Rgroups being phenyl groups; 'a' is 0, 1, or 2; 0.8&#x2266;w&#x3c;1.0 and v+w=1; 0&#x3c;x&#x3c;0.4, 0.5&#x3c;y&#x3c;1, 0&#x3c;z&#x3c;0.4, and x+y+z=1); and (B) an organosilicon compound that contains in one molecule two or more silicon-bonded hydrogen atoms, in which not less than 5 mole % of all silicon-bonded univalent groups are univalent aromatic hydrocarbon groups, in the presence of (C) a hydrosilylation catalyst.

Free films made of cured organopolysiloxane resins, process for production thereof, and laminated films

There is disclosed an organopolysiloxane having bifunctional biphenyl groups of the formula I ##STR1## wherein Q is selected from the group consisting of a nitro group, a substituted amino group and an unsubstituted amino group, Z is an organopolysiloxane group represented by the formula II ##STR2## in which R.sup.1 is a divalent organic group having at least 2 carbon atoms, R.sup.2 through R.sup.6 are the same or different monovalent organic groups, n is an integer having a value of at least 1 and m is 0 or 1. The above organopolysiloxane may be reacted with an aromatic tetracarboxylic acid dianhydride and, optionally, with an aromatic diamine to obtain a polyamide acid, which may then be subjected to a thermal imidization step to provide a polyimide having repeating units shown by the formulas VI and VII ##STR3## wherein A.sup.1 is a tetravalent aromatic group, A.sup.3 is a divalent aromatic group and A.sup.2 is a divalent organic group which contains a siloxane residue and wherein the molar ratio of repeating unit VI to repeating unit VII in the range 100:0 to 1:99.

Growing community of inventors

Tokyo, Japan

Maki Itoh