Sumitomo Electric Industries, Limited

Sumitomo Electric Printed Circuits, Inc.

Maki Ikebe

Shoichiro Sakai

Kousuke Miura

Koji Nitta

Junichi Motomura

Kenji Takahashi

Masahiro Itoh

Hiroshi Ueda

Kohei Okamoto

Kouji Nitta

Masahiro Itou

Shingo Nagata

A flexible printed wiring board according to an aspect of the present disclosure is a flexible printed wiring board including a base film and a plurality of wiring lines disposed on a front surface of the base film. Each of the wiring lines has a front end surface extending in a longitudinal direction of the wiring line and two side surfaces extending in the longitudinal direction, and the side surfaces have an arithmetical mean roughness Ra of 0.05 μm to 2.0 μm. The wiring lines have an average height of 40 μm to 120 μm. The wiring lines have an average spacing of 1 μm to 30 μm.

Flexible printed wiring board and method of manufacturing the same

A printed wiring board includes an electrically insulating base film, and an electrically conductive pattern stacked on at least one surface side of the base film. An average width of multiple wiring portions included in the electrically conductive pattern is 5 μm or greater and 20 μm or less. Each of the wiring portions includes a seed layer and a plating layer. The plating layer includes copper crystal planes of a (111) plane, a (200) plane, a (220) plane, and a (311) plane. An intensity ratio IRof an X-ray diffraction intensity of the copper crystal plane (220) obtained by Equation (1) below is 0.05 or greater and 0.14 or less,/()  (1)(where I, I, I, Iare respectively X-ray diffraction intensity of the (111) plane (200) plane, the (220) plane, and the (311) plane).

Printed wiring board and method of manufacturing the same

A printed wiring board production method that forms a base film and a conductive pattern on the base film by an additive method or a subtractive method, includes a plating process that electroplates the conductive pattern on a surface of the base film, wherein the plating process includes a shield plate arranging process that arranges a shield plate between an anode and a printed wiring board substrate that forms a cathode, and a substrate arranging process that arranges the printed wiring board substrate in a plating tank, and wherein a distance between the shield plate and the printed wiring board substrate is 50 mm or greater and 150 mm or less.

Printed wiring board production method and printed wiring board production apparatus

A printed wiring board according to an aspect of the present invention includes a base film having insulation properties and a conductive pattern including multiple wiring portions laminated, the conductive pattern running on at least one surface of the base film, wherein each wiring portion includes a first conductive portion and a second conductive portion coating an outer surface of the first conductive portion, wherein an average width of each wiring portion is 10 &#x3bc;m or greater to 50 &#x3bc;m or smaller, and an average thickness of the second conductive portion is 1 &#x3bc;n or greater to smaller than 8.5 &#x3bc;m.

Printed wiring board and manufacturing method thereof

A printed wiring board includes a base film having insulation properties and a conductive pattern including multiple wiring portions laminated so as to run on at least one surface of the base film, wherein each wiring portion includes a first conductive portion and a second conductive portion coating an outer surface of the first conductive portion, wherein an average width of each wiring portion is 10 &#x3bc;m or greater to 50 &#x3bc;m or smaller, and an average thickness of the second conductive portion is 1 &#x3bc;m or greater to smaller than 8.5 &#x3bc;m. A method for manufacturing a printed wiring board includes a first conductive portion forming step of forming a first conductive portion forming each wiring portion by plating an opening of the resist pattern on the conductive foundation layer, a conductive foundation layer removing step, and a second conductive portion coating step.

A base material for printed interconnect boards according to one aspect of the present invention includes a base film; and at least one conductive layer that is layered on the base film. The base material for printed interconnect boards includes a product in which a plurality of interconnect board pieces are regularly arrayed in plan view and includes an outer frame region surrounding the product. The outer frame region includes a proximity region within 5 mm from an outer edge of the product and includes an outside region other than the proximity region. A layered conductive layer area rate of the proximity region is smaller than a layered conductive layer area rate of the product.

Growing community of inventors

Osaka, Japan

Maki Ikebe