Sekisui Chemical Co., Ltd.

Mai Yamagami

Takeshi Wakiya

Satoshi Haneda

Yasuyuki Yamada

Saori Ueda

Masao Sasadaira

Particles that can suppress the occurrence of cracking during a stress load in a connection part that connects two members to be connected are provided. The particles according to the present invention are particles used to obtain a connecting material for forming the connection part that connects two members to be connected, and the particles are used for forming the connection part such that thickness of the connection part after connection exceeds twice the average particle diameter of the particles before connection, or the particles have an average particle diameter of 0.1 &#x3bc;m or more and 15 &#x3bc;m or less, the particles have a 10% K value of exceeding 3000 N/mmand 20000 K/mmor less, and the particles have a particle diameter CV value of 50% or less.

Particles, connecting material and connection structure

A connecting material that can suppress the occurrence of cracking during a stress load in a connection part that connects two members to be connected, further can suppress the variation in thickness in the connection part to ensure the heat dissipation performance, and can increase the connection strength is provided. The connecting material according to the present invention is a connecting material used for forming the connection part that connects two members to be connected, the connecting material contains particles and metal atom-containing particles, the particles are used for forming the connection part such that thickness of the connection part after connection is twice or less the average particle diameter of the particles before connection, or the particles have an average particle diameter of 1 &#x3bc;m or more and 300 &#x3bc;m or less, the particles have a 10% K value of exceeding 3000 N/mmand 20000 N/mmor less, and the particles have a particle diameter CV value of 10% or less.

Connecting material and connection structure

Particles that can suppress the occurrence of cracking or peeling during a thermal cycle in a connection part that connects two members to be connected, further can suppress the variation in thickness in the connection part, and can increase the connection strength are provided. The particles according to the present invention are particles used to obtain a connecting material for forming a connection part that connects two members to be connected, and the particles are used for forming the connection part such that thickness of the connection part after connection is twice or less the average particle diameter of the particles before connection, or the particles have an average particle diameter of 1 &#x3bc;m or more and 300 &#x3bc;m or less, the particles have a 10% K value of 30 N/mmor more and 3000 N/mmor less, and the particles have a particle diameter CV value of 10% or less.

Particles that can suppress the occurrence of cracking or peeling during a thermal cycle in a connection part that connects two members to be connected are provided. The particles according to the present invention are particles used to obtain a connecting material for forming a connection part that connects two members to be connected, and the particles are used for forming the connection part such that thickness of the connection part after connection exceeds twice the average particle diameter of the particles before connection, or the particles have an average particle diameter of 0.1 &#x3bc;m or more and 15 &#x3bc;m or less, the particles have a 10% K value of 30 N/mmor more and 3000 N/mmor less, and the particles have a particle diameter CV value of 50% or less.

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Osaka, Japan

Mai Yamagami