Nvidia Corporation

Mahmut Yilmaz

Shantanu Sarangi

Amit D Sanghani

Milind Bhaiyyasaheb Sonawane

Jonathon E Colburn

Sailendra Chadalavda

Pavan Kumar Datla Jagannadha

Karthikeyan Natarajan

Dheepakkumaran Jayaraman

Nithin Anil Valentine

Tezaswi Raja

Jue Wu

Ish Chadha

Anubhav Sinha

Sailendra Chadalavada

Jae Wu

Suhas Satheesh

Kaushik Narayanun

Kevin Wilder

Bonita Bhaskaran

Bala Tarun Nelapatla

Smbat Tonoyan

Rajendra Kumar ReddyS

Dan Smith

Charlie Hwang

Kevin Zhou

Seyed Nima Mozaffari Mojaveri

Kerwin Fu

Munish Aggarwal

Doochul Shin

Vinod Pagalone

Kevin Ye

Introduced herein is a technique that reliably measures on-die noise of logic in a chip. The introduced technique places a noise measurement system in partitions of the chip that are expected to cause the most noise. The introduced technique utilizes a continuous free-running clock that feeds functional frequency to the noise measurement circuit throughout the noise measurement scan test. This allows the noise measurement circuit to measure the voltage noise of the logic during a shift phase, which was not possible in the conventional noise measurement method. Also, by being able to measure the voltage noise during a shift phase and hence in both phases of the scan test, the introduced technique can perform a more comprehensive noise measurement not only during ATE testing but as part of IST in the field.

Technique for enabling on-die noise measurement during ate testing and IST

An integrated circuit package includes two or more discrete semiconductor dies coupled to a package substrate. The dies include a primary die and at least one secondary die. The primary die includes an external data transfer interface, a direct memory access ('DMA') controller, a primary cross-die bridge, and at least one primary die-to-die interface. At least one of the secondary dies includes a secondary test controller, a secondary cross-die bridge, and a secondary die-to-die interface. A secondary die is operable to send a test data read request to a host system and to receive a test data read response therefrom. The secondary die is further operable to cause a test to be performed on circuitry within the die responsive to contents in the test data read response.

Test data transfer in multi-die systems

A system can include a memory and a processing device, operatively coupled to the memory, to perform operations including receiving a header block of an ordered set of blocks. The header block includes a header block payload and a first digest. The operations further include authenticating, based on the header block payload, the header block, and receiving a first data block of the ordered set of blocks. The first data block includes a first data block payload and a second digest. The operations further include authenticating, based on the first digest, the first data block, and processing the first data block payload.

Test data authentication and processing using scalable data structures

A circuit for improving control over asynchronous signal crossings during circuit scan tests includes multiple scan registers and a decoder configured to translate a combined output of the scan registers into multiple one-hot controls to the local clock gates of scan registers disposed in multiple different clock domains. Programmable registers are provided to selectively enable and disable the local clock gates of the different clock domains.

Flexible one-hot decoding logic for clock controls

The disclosure provides using test processors to provide a more flexible solution compared to the existing DFX blocks that are used for controlling test networks in chips. The test processors provide a highly flexible solution since programming of the test processors can be changed at any time; even after manufacturing, and can support practically an unlimited number of core chips in any configuration. The high flexibility provided via the test processors can reduce engineering effort needed in design and verification, accelerate schedules, and may prevent additional tapeouts in case of DFX design bugs. By making debug and diagnosis easier by providing an opportunity to change debug behavior as needed, the time-to-market timeline can be accelerated. Accordingly, the disclosure provides a chip with a test processor, a multi-chip processing system with a test processor, and a method of designing a chip having a test processor.

Controlling test networks of chips using integrated processors

In one embodiment, a test system comprises: a plurality of test partitions and a centralized controller configured to coordinate testing between the plurality of test partitions. At least one of the plurality of test partitions comprises: a partition test interface controller configured to control testing within at least one test partition in accordance with dynamic selection of a test mode, and at least one test chain configured to perform test operations. The dynamic selection of the test mode and control of testing within a test partition can be independent of selection of a test mode and control in others of the plurality of test partitions. In one embodiment, a free running clock signal is coupled to a test partition, and the partition test mode controller transforms the free running clock signal into a local partition test clock which is controlled in accordance with the dynamic selection of the test mode.

Dynamic independent test partition clock

A method for testing. An external clock frequency is generated. Test data is supplied over a plurality of SSI connections clocked at the external clock frequency, wherein the test data is designed for testing a logic block. A DSTA module is configured for the logic block that is integrated within a chip to a bandwidth ratio, wherein the bandwidth ratio defines the plurality of SSI connections and a plurality of PSI connections of the chip. The external clock frequency is divided down using the bandwidth ratio to generate an internal clock frequency, wherein the bandwidth ratio defines the external clock frequency and the internal clock frequency. The test data is scanned over the plurality of PSI connections clocked at the internal clock frequency according to the bandwidth ratio, wherein the plurality of PSI connections is configured for inputting the test data to the plurality of scan chains.

Method and system for dynamic standard test access (DSTA) for a logic block reuse

Granular dynamic test systems and methods facilitate efficient and effective timing of test operations. In one embodiment, a chip test system comprises: a first test partition operable to perform test operations based upon a first local test clock signal; a second test partition operable to perform test operations based upon a second local test clock signal; and a centralized controller configured to coordinate testing between the plurality of test partitions, wherein the coordination includes managing communication of test information between the plurality of test partitions and external pins. In one exemplary implementation, a trigger edge of the first local test clock signal is staggered with respect to a trigger edge of the second local test clock signal, wherein the stagger is coordinated to mitigate power consumption by test operations in the first test partition and test operations in the second test partition.

Independent test partition clock coordination across multiple test partitions

In one embodiment, a test system comprises: a test partition configured to perform test operations; a centralized test controller for controlling testing by the test partition; and a test link interface controller configured to communicate between the centralized test controller and the test partition, wherein the test link interface controller controls dynamic changes to external pads associated with the test operations. The test link interface controller dynamically selects between an input direction and output direction for the external pads. The test link interface includes a pin direction controller that generates direction control signals based on the state of local test controller and communicates the desired direction to a boundary scan cell associated with the pin. The boundary scan cell programs the pad to either input or output direction depending on direction control signals. The input direction corresponds to driving test data and the output direction corresponds to observing test data.

Test partition external input/output interface control for test partitions in a semiconductor

Growing community of inventors

Los Altos Hills, CA, United States of America

Mahmut Yilmaz