Nec Corporation

Mahiro Hachiya

Minoru Yoshikawa

Hitoshi Sakamoto

Masaki Chiba

This electronic apparatuscomprises a heating element, and a case. The casehas an opening hole. In order that a refrigerant COO will be sealed between the caseand the heating element, the outer periphery part of a first heating element external surface, which is the external surface of the heating element, is attached to the outer periphery part of the opening hole. Also, the refrigerant COO is a refrigerant that is capable of phase change from a liquid refrigerant LP-COO to a gas phase refrigerant GP-COO. As a result, it is possible to more efficiently cool the heat of the heating element

Electronic apparatus

Provided are a phase change cooler with enhanced cooling performance and enhanced pressure resistance performance, and an electronic device using such a phase change cooler. The phase change cooler includes a heat receiving unit, a heat dissipating unit, a vapor pipe and a liquid pipe that interconnect the heat receiving unit and the heat dissipating unit to form a loop, and refrigerant encapsulated inside the phase change cooler. The heat receiving unit has an approximately semicircular cross section, and the vapor pipe is coupled to an inclined face of the heat receiving unit.

Phase change cooling system and electronic device

An evaporator includes: a first surface which conducts heat; a heat medium in the evaporator, which vaporizes as a result of the heat absorbed; a condenser which liquefies the heat medium in a vaporized state; a vapour pipe which guides the heat medium in the vaporized state from the evaporator to the condenser; and a liquid pipe which guides the heat medium in a liquefied state from the condenser to the evaporator. A first opening of the vapour pipe and a second opening of the liquid pipe are disposed in different positions from each other in a first direction, and are disposed so as to open into a heat medium accommodation space inside the evaporator at different positions from each other in a second direction, and which is different to the first direction, and also at different positions from each other in a third direction which intersects the first surface.

Cooling device

A cooler grows in size and its structure becomes complicated in a phase-change cooler if it is intended to cool a plurality of heating elements; therefore, a phase-change cooler according to an exemplary aspect of the present invention includes a heat-conducting board configured to be thermally connected to a cooling object; heat receiving means for storing a refrigerant and receiving heat of the cooling object through the heat-conducting board; radiation means for radiating heat, condensing and devolatilizing a vapor-phase refrigerant arising from vaporization of the refrigerant in the heat receiving means; and connection means for connecting the heat receiving means and the radiation means.

Phase-change cooler and phase-change cooling method

A cooling deviceincludes a first heat receiving unit, a second heat receiving unit, a first heat dissipating unit, and a second heat dissipating unit. The first heat dissipating unitand the second heat dissipating unithave a flat plate shape and have a structure in which air passes in a direction approximately perpendicular to a principal surface having a flat plate shape and a first principal surfacethat is a principal surface having a flat plate shape in the first heat dissipating unitand a second principal surfacethat is a principal surface having a flat plate shape in the second heat dissipating unitare arranged so as to face to each other. As a result, the size of the cooling devicecan be reduced without degrading a heat dissipation performance to dissipate heat generated by a heat generating element.

Growing community of inventors

Tokyo, Japan

Mahiro Hachiya