Huntsman Advanced Materials Americas LLC

Vantico Limited

Huntsman Advanced Materials LLC

Mahesh Kotnis

Paul Terrence Wombwell

Elizabeth Louise Otloski

William Walter Charles Badcock

Richard Martin Broad

Kenneth R Filipiak

David D Schwarting

Brian H Kukulies

The present disclosure relates to a seamless model free of bond lines made by a method which includes the steps of providing a substructure having an exposed outer surface, applying a modeling paste to the outer surface of the substructure in the form of a continuous layer, curing the continuous layer of applied modeling paste, and machining said cured layer of modeling paste to the desired contour to form the seamless model. The modeling paste may be a mechanically frothed syntactic foam prepared by injecting inert gas with mechanical stirring into either a formed froth-forming polyurethane or epoxy composition containing microballoons.

Seamless model and method of making a seamless model

The invention relates to a seamless model free of bond lines and to a method of making same. The method includes the sequential steps of providing a substructure having an exposed outer surface, applying a modeling paste to the outer surface of the substructure in the form of a continuous layer, curing the continuous layer of applied modeling paste, and machining said cured layer of modeling paste to the desired contour. The modeling paste of the invention is a mechanically frothed syntactic foam prepared by injecting inert gas with mechanical stirring into either a formed froth-forming composition, which is preferably a polyurethane or epoxy froth-forming composition containing microballoons. The polyurethane composition exemplified herein comprises (1) an organic polyisocyanate component; (2) a polyol component comprising (a) greater than 50%, by weight of a high molecular weight polyol and (b) less than 50%, by weight, of a low molecular weight polyol; and (3) a chemical thixotropic agent in an amount sufficient to induce thixotropic properties. The epoxy composition preferably comprises (1) an epoxy resin; (2) a thixotropic agent in an amount sufficient to induce thixotropic properties; and (3) a hardener comprising (a) at least one polyethyleneimine and (b) at least one other amine having at least two amino hydrogen groups, the combined amounts of (a) and (b) being sufficient to effect cure of the epoxy resin.

The present invention relates to a method for making a prototype by providing at least one polymeric board material having a glass transition temperature less than the molten temperature of a thermoplastic molding material and removing at least a portion of the polymeric board material to form, according to a computer-aided design, a reverse image of a desired article to be molded. Selected molten polymeric molding material is injected into the resulting mold to produce the desired prototype.

Process for producing direct tooling mold and method for using the same

Growing community of inventors

Okemos, MI, United States of America

Mahesh Kotnis