Applied Materials, Inc.

Mahendra Christopher Orilall

Rajeev Bajaj

Daniel Redfield

Jason Garcheung Fung

Fred Conrad Redeker

Boyi Fu

Nag B Patibandla

Ashwin Chockalingam

Mayu Felicia Yamamura

Gregory E Menk

Hou Tee Ng

Kasiraman Krishnan

Sivapackia Ganapathiappan

Robert E Davenport

Russell Edward Perry

Ashavani Kumar

Veera Raghava Reddy Kakireddy

Aniruddh Jagdish Khanna

Mario Dagio Cornejo

Amritanshu Sinha

Venkat Hariharan

Karl M Brown

Robert Z Bachrach

Connie P Wang

Lu Yang

Hooman Bolandi

Victor Pebenito

Raman Talwar

Robert D Tolles

Timothy B Michaelson

Ashwin Chockalingham

Rob Davenport

Venkatachalam Hariharan

Raghava Kakireddy

A polishing article manufacturing system includes a feed section and a take-up section, the take-up section comprising a supply roll having a polishing article disposed thereon for a chemical mechanical polishing process, a print section comprising a plurality of printheads disposed between the feed section and the take-up section, and a curing section disposed between the feed section and the take-up section, the curing section comprising one or both of a thermal curing device and an electromagnetic curing device.

Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles

Implementations described herein generally relate to polishing articles and methods of manufacturing polishing articles used in polishing processes and cleaning processes. More particularly, implementations disclosed herein relate to composite polishing articles having graded properties. In one implementation, a polishing article is provided. The polishing article comprises one or more exposed first regions formed from a first material and having a first zeta potential and one or more second exposed regions formed from a second material and having a second zeta potential, wherein the first zeta potential is different from the second zeta potential.

Apparatus and method of forming a polishing article that has a desired zeta potential

Embodiments of the disclosure generally provide polishing pads having a composite pad body and methods for forming the polishing pads. In one embodiment, the composite pad body includes one or more first features formed from a first material or a first composition of materials, and one or more second features formed from a second material or a second composition of materials, wherein the one or more first features and the one or more second features are formed by depositing a plurality of layers comprising the first material or first composition of materials and second material or second composition of materials.

CMP pad construction with composite material properties using additive manufacturing processes

Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, addition polymer precursor compounds, catalysts, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one polymer precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions. Embodiments of the disclosure further provide a polishing pad with polymeric layers that may be interpenetrating polymer networks.

Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process

Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process

Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one resin precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions.

Polishing pads produced by an additive manufacturing process

Precursor formulations for polishing pads produced by an additive manufacturing process

Apparatus and method of forming a polishing pads by use of an additive manufacturing process

Advanced polishing pad materials and formulations

The present disclosure relates generally to a polishing article, and apparatus and methods of chemical mechanical polishing substrates using the polishing article. In some embodiments, the polishing article, such as a polishing pad, includes multiple layers in which one or more layers (i.e., at least the top layer) includes a plurality of nano-fibers that a positioned to contact a substrate during a polishing process. In one embodiment, a polishing article comprises a layer having a thickness less than about 0.032 inches, and the layer comprising fibers having a diameter of about 10 nanometers to about 200 micro meters.

Multi-layered nano-fibrous CMP pads

Apparatus for forming a polishing article that has a desired zeta potential

Embodiments of the disclosure generally provide polishing pads includes a composite pad body and methods for forming the polishing pads. One embodiment provides a polishing pad including a composite pad body. The composite pad body includes one or more first features formed from a first material or a first composition of materials, and one or more second features formed from a second material or a second composition of materials, wherein the one or more first features and the one or more second features are formed by depositing a plurality of layers comprising the first material or first composition of materials and second material or second composition of materials.

Growing community of inventors

Santa Clara, CA, United States of America

Mahendra Christopher Orilall