Infineon Technologies Ag

Mahadi-Ul Hassan

Petteri Palm

Thomas Gebhard

Martin Henning Vielemeyer

Juan Sanchez

Eslam Abdelhamid

A pre-packaged chip includes a chip having at least one electrical top contact at a top side of the chip and at least one electrical bottom contact at a bottom side, a first laminate layer on the top side, a second laminate layer on the bottom side, the first laminate layer and the second laminate layer being laminated together to sandwich the chip therebetween, a first metal layer on the first laminate layer and electrically contacted to the at least one electrical top contact via at least one top contact hole through the first laminate layer, and a second metal layer on the second laminate layer and electrically contacted to the at least one electrical bottom contact via at least one bottom contact hole through the second laminate layer. The pre-packaged chip is free from any contact hole extending from the first metal layer to the second metal layer.

Pre-packaged chip, method of manufacturing a pre-packaged chip, semiconductor package and method of manufacturing a semiconductor package

A printed circuit board and method of manufacturing a printed circuit board are disclosed. In one example, the method comprises embedding an electronic component in a laminate, and protecting the electronic component against electrostatic discharge during at least part of the manufacturing process by an electrically conductive electrostatic discharge protection structure integrated in the laminate and connected to the electronic component.

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Wuppertal, Germany

Mahadi-Ul Hassan