Molecular Imprints, Inc.

University of Texas System

Mahadevan Ganapathisubramanian

Byung-Jin Choi

Mario Johannes Meissl

Sidlgata V Sreenivasan

Michael Nevin Miller

Michael P C Watts

Nicholas A Stacey

Pawan Kumar Nimmakayala

Liang Kai Wang

Yeong-Jun Choi

Alex Ruiz

Sldlgata V Sreenivasan

Systems, methods, and processes for separating a template from a substrate retained on an air cavity chuck during an imprint lithography process. Generally, vacuum level provided by air cavity chuck may be controlled during conforming of polymerizable material between the template and the substrate and during separation of the template and the substrate.

Separation in an imprint lithography process

Energy sources and methods for curing in an imprint lithography system are described. The energy sources may include one or more energy elements positioned outside of the viewing range of an imaging unit monitoring elements of the imprint lithography system. Each energy source is configured to provide energy along a path to solidify polymerizable material on a substrate.

Energy sources for curing in an imprint lithography system

Systems and methods for imprinting a patterned layer on a substrate are described. Features of patterned layer may be concentrically imprinted in relation to a shaft positioned on a substrate chuck. The substrate may be biased using a radius difference between a diameter of the shaft and an inner diameter of the substrate in relation to a point on an inner edge of the substrate.

Substrate alignment

System, method and process for imprinting a substrate using controlled deformation of a substrate and/or a template. The substrate and/or template may be positioned in single wave formation or double wave formation during an imprint lithography process.

Imprint lithography system and method

A method for spreading a conformable material between a substrate and a template having a mold. The method comprises positioning the mold to be in superimposition with the substrate defining a volume therebetween. A first sub-portion of the volume is charged with the conformable material through capillary action between the conformable material and one of the mold and the substrate. A second sub-portion of the volume is filled with the conformable material by creating a deformation in the mold.

Bifurcated contact printing technique

The present invention is directed towards a method of expelling a gas positioned between a substrate and a mold, the substrate and the mold further having a liquid positioned therebetween.

Method for expelling gas positioned between a substrate and a mold

The present method features an active compliant pin chuck to hold a substrate, having opposed first and second surfaces, and compensates for non-planarity in one of the surfaces of the substrate. To that end, the method includes creating a point contact on the first surface to generate a change in shape of the second surface to obtain a desired shape of the second surface. The desired shape may be smooth, if not substantially planar or any other shape desired within the operational parameters of the chuck and the substrate. For example, the method may compensate for non-planarity due to particulate matter on the first surface and substrate topography. These and other embodiments are discussed more fully below.

Adaptive shape substrate support method

The present method and system features an active compliant pin chuck to hold a substrate, having opposed first and second surfaces, and compensates for non-planarity in one of the surfaces of the substrate. To that end, the support system includes a chuck having a plurality of piezo pins and reference pins, with the piezo pins being coupled to piezo actuators to undergo relative movement with respect to said reference pins. These and other embodiments are discussed more fully below.

Growing community of inventors

Austin, TX, United States of America

Mahadevan Ganapathisubramanian