International Business Machines Corporation

Maganlal S Patel

Kishor V Desai

John J Zopff

Sanjeev Balwant Sathe

Edwin Lorimer Thomas

Thomas G Macek

An apparatus, and a corresponding method, for stress testing both wire bond-type semiconductor chips and C4-type semiconductor chips is disclosed.

Apparatus, and corresponding method, for stress testing semiconductor

An electronic package which includes a substrate having a dielectric layer, a circuitized layer located on one surface of the dielectric and a thermally and electrically conductive layer located on a second surface of the dielectric, this thermally and conductive layer designed for providing enhanced heat removal from the package's semiconductor device. A pedestal element is located on or formed as part of the thermal and electrically conductive layer, and extends through the dielectric and circuitized layers for having the semiconductor device positioned thereon. The semiconductor device is thus in substantially direct thermal communication with the pedestal element and thus the adjacent, thick thermal conductive layer which functions as the package's heat sink. In one embodiment, solder is provided on the pedestal element to interconnect desired portions of the circuitized layer with the pedestal element (e.g., to provide electrical ground). A method of making such an electronic package is also defined herein.

Method of making an electronic package with enhanced heat sinking

Electronic package with enhanced heat sinking

An electrical connector for interconnecting a pair of circuit members (e.g., printed circuit boards) wherein the connector includes a plurality of electrical contacts, these contacts including at least one semi-spherical end portion for engaging a respective conductor on one of the circuit members. Significantly, the semi-spherical end portion is capable of moving in two different directions of rotation during such engagement to provide an effective wiping motion against the surfaces of the member's conductor. In one embodiment, the connector includes contacts with opposed, semi-spherical end portions, while in another embodiment, a singular semi-spherical end portion is taught.

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Endicott, NY, United States of America

Maganlal S Patel