Nxp B.v.

Magali Lambert

Franciscus Petrus Widdershoven

Erwin Hijzen

Evelyne Gridelet

Pablo Garcia Tello

A sensor chip () for detecting particles, the sensor chip () comprising a substrate (), an electric connection structure () arranged in a surface portion of the substrate () and adapted for an electric connection to an electric connection element (), a sensor active region () arranged in another surface portion of the substrate () and being sensitive to the presence of the particles to be detected, and a continuous dielectric layer () covering the substrate () including covering the electric connection structure () and the sensor active region ().

Sensor chip and method of manufacturing the same

Disclosed is an integrated circuit () comprising a substrate () carrying a plurality of light-sensitive elements () and a blazed grating () comprising a plurality of diffractive elements () for diffracting respective spectral components (-) of incident light () to respective light-sensitive elements (), the blazed grating () comprising a stack of layers, at least some of these layers comprising first portions, e.g. metal portions () arranged such that each diffractive element () comprises a stepped profile of stacked first portions with a first portion in a higher layer laterally extending beyond a first portion in a lower layer of said stepped profile.

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Versailles, France

Magali Lambert