International Business Machines Corporation

Google Inc.

Lenovo (singapore) Pte. Ltd.

Facebook, Inc.

Other

Madhusudan K Iyengar

Richard C Chu

Robert E Simons

Michael J Ellsworth, Jr

Levi A Campbell

Roger R Schmidt

Milnes P David

David P Graybill

Vinod Kamath

Timothy Joseph Chainer

Hendrik F Hamann

Mark Edward Steinke

Pritish Ranjan Parida

Jorge Padilla

Prabjit Singh

Bejoy J Kochuparambil

James Andrew Lacey

Teckgyu Kang

Christopher Gregory Malone

Yuan Hang Li

Mark Delorman Schultz

Norman Paul Jouppi

Woon-Seong Kwon

Gerard Vincent Weber, Jr

Padam Jain

Howard V Mahaney, Jr

Kenneth Robert Schneebeli

Melanie Beauchemin

Theodore Gerard Van Kessel

Eric Alan Eckberg

Connor Burgess

Alan Claassen

Evan G Colgan

Donald W Porter

Matthew R Archibald

Emad Samadiani

Jerry Chiu

Yves Corfield Martin

Elmootazbellah Nabil Elnozahy

Juan C Rubio

Wael R El-Essawy

Thomas W Keller, Jr

Feini Zhang

Allan R Hoeft

Paul Alfred Lauro

Da-Yuan Shih

Jason Aaron Matteson

Bruce Kenneth Furman

Patrick Anthony Coico

Randall G Kemink

Martin Patrick O'Boyle

Jeffrey A Newcomer

William F Edwards

Wayne A Barringer

Howard P Welz

Yuan Li

James J Steffes

Dennis John Hansen

Xiaojin Wei

Michael A Gaynes

Karthick Rajamani

Jing Zhang

Raschid Jose Bezama

Lixin Zhang

William Evan Speight

Eric James McKeever

John Bruce Carter

Francis R Krug, Jr

Steven C McIntosh

John Harold Magerlein

Gregory P Imwalle

Cary Huettner

William Frank Edwards

Michael Chi Kin Lau

Matthew A Nobile

Zuowei Shen

Federico Pio Centola

Avinash Panga

Timothy Conrad Lee

Justin Sishung Lee

Keith E Fogel

Michael Rizzolo

Eren Kursun

Wesley Michael Felter

Jian Li

Dustin W Demetriou

Jason David Adrian

Martin Joseph Crippen

Jon Brian Ehlen

Stephen Peter Mroz

Howard Victor Mahaney, Jr

Michael Sven Miller

Steven John Ahladas

Gregory Sizikov

Maurice Francis Holahan

Aparna Vallury

Woon Seong Kwon

Enrico A Romano

Wei Zou

Sundar Rajan

A housing and cooling system for computer hardware includes an infrastructure module and a payload module. The infrastructure module is configured for housing computer hardware and is equipped with either or both of a convective air cooling system and an arrangement of metal plates connected by one or more conduits for carrying liquid for cooling computer equipment housed by the infrastructure module. The infrastructure modules also houses a programmable logic controller ('PLC'). The payload module includes an immersion cooling system governed by the PLC and is located outside of the infrastructure module.

Modular liquid cooling architecture for liquid cooling

Methods, systems, and apparatus for liquid coolant replacement in a cooling distribution unit during operation of the cooling distribution unit. Active liquid coolant to be replaced is removed from the flow cycle of the cooling distribution unit while the coolant distribution unit is operational and providing cooling to an electronic system. Additionally, replacement liquid coolant is provided to the flow cycle while the coolant distribution unit is operational and providing cooling to an electronic system.

Continuous feed liquid coolant replacement

Methods, systems, and apparatus, including an integrated circuit (IC) with a ring-shaped hot spot area. In one aspect, an IC includes a first area along an outside perimeter of a surface of the IC. The first area defines a first inner perimeter. The IC includes a second area that includes a center of the IC and that includes a first set of components. The second area defines a first outer. The IC includes a ring-shaped hot spot area between the first area and the second area. The ring-shaped hot spot area defines a ring outer perimeter that is juxtaposed with the first inner perimeter. The ring-shaped hot spot area defines a ring inner perimeter that is juxtaposed with the first outer perimeter. The ring-shaped hot spot area includes a second set of components that produce more heat than the first set of components.

Integrated circuit with a ring-shaped hot spot area and multidirectional cooling

Systems and methods for using spring force based compliance to minimize the bypass liquid flow gaps between the tops of chip microfins and bottom side of manifold ports are disclosed herein. A fluid delivery and exhaust manifold structure provides direct liquid cooling of a module. The manifold sits on top of a chip with flow channels. Inlet and outlet channels of the manifold in contact with flow channels of the chip creates an intricate crossflow path for the coolant resulting in improved heat transfer between the chip and the working fluid. The module is also designed with pressure reduction features using internal leakage flow openings to account for pressure differential between fluid entering and being expelled from the module.

Spring loaded compliant coolant distribution manifold for direct liquid cooled modules

Systems and methods for utilizing the dead space around the periphery of a chip for sealing a direct liquid cooled module are disclosed. One of the functions of a direct liquid cooled module is to provide cooling liquid to components located on a chip. A groove member for receiving a sealing member may be applied to the top surface of the chip. The groove member may be directly deposited to the top surface or coupled thereto via an adhesive and/or epoxy. The groove member may be in the form of opposing sidewalls or a u-shaped structure each of which form a partial enclosure for receipt of the sealing member. The groove member may be located entirely within the dead space or at least partially within the dead space and partially within a central area in which the chip components are located. The sealing member may be an O-ring or a gasket.

Direct liquid cooling with O-ring sealing

A method of manufacturing a chip assembly comprises joining an in-process unit to a printed circuit board; reflowing a bonding material disposed between and electrically connecting the in-process unit with the printed circuit board, the bonding material having a first reflow temperature; and then joining a heat distribution device to the plurality of semiconductor chips using a thermal interface material ('TIM') having a second reflow temperature that is lower than the first reflow temperature. The in-process unit further comprises a substrate having an active surface, a passive surface, and contacts exposed at the active surface; an interposer electrically connected to the substrate; a plurality of semiconductor chips overlying the substrate and electrically connected to the substrate through the interposer, and a stiffener overlying the substrate and having an aperture extending therethrough, the plurality of semiconductor chips being positioned within the aperture.

Methods and heat distribution devices for thermal management of chip assemblies

A heat exchanger includes a first manifold having an inlet opening and a second manifold having an outlet opening. A group of conduits fluidly connect the first manifold and the second manifold to one another such that a flow path is established for liquid to flow from the inlet opening to the outlet opening. The flow path includes a select portion that extends through all conduits within the group of conduits. Valves are located in the first manifold and the second manifold. The valves are operable to change the select portion of the flow path from between a first state, wherein the conduits within group of conduits are fluidly connected in parallel with one another, and a second state, wherein the conduits within the group of conduits are fluidly connected in series with one another.

An IC die includes a temperature control element suitable for three-dimensional IC package with enhanced thermal control and management. The temperature control element may be formed as an integral part of an IC die that may assist temperature control of the IC die when in operation. The temperature control element may include a heat dissipation material disposed therein to assist dissipating thermal energy generated by the plurality of devices in the IC die during operation.

Three dimensional IC package with thermal enhancement

An IC die includes a temperature control element suitable for three-dimensional IC package with enhanced thermal control and management. The temperature control element may assist temperature control of the IC die when in operation. In one example, the temperature control element may have a plurality of thermal dissipating features disposed on a first surface of the IC die to efficiently control and dissipate the thermal energy from the IC die when in operation. A second surface opposite to the first surface of the IC die may include a plurality of devices, such as semiconductors transistors, devices, electrical components, circuits, or the like, that may generate thermal energy when in operation. The temperature control element may provide an IC die with high efficiency of heat dissipation that is suitable for 3D IC package structures and requirements.

Temperature control element utilized in device die packages

A data rack system includes a data center rack frame, a shelf positioned within the data center rack frame; and a modular battery unit disposed on the shelf. The modular battery unit further includes a housing having an outer surface, a plurality of strips of phase change material ('PCM') attached to the outer surface and spaced apart from one another; and air flow channels. The air flow channels are formed in spaces between two adjacent strips of the plurality of strips and defined by a shape and size of the spaces between the two adjacent strips.

Thermal management of battery units on data center racks

A server tray package includes a motherboard assembly that includes a plurality of data center electronic devices, the plurality of data center electronic devices including at least one heat generating processor device; and a liquid cold plate assembly. The liquid cold plate assembly includes a base portion mounted to the motherboard assembly, the base portion and motherboard assembly defining a volume that at least partially encloses the plurality of data center electronic devices; and a top portion mounted to the base portion and including a heat transfer member shaped to thermally contact the heat generating processor device, the heat transfer member including an inlet port and an outlet port that are in fluid communication with a cooling liquid flow path defined through the heat transfer member.

Cooling electronic devices in a data center

A data center cooling system has an indoor portion wherein heat is absorbed from components in the data center, and an outdoor heat exchanger portion wherein outside air is used to cool a first heat transfer fluid (e.g., water) present in at least the outdoor heat exchanger portion of the cooling system during a first mode. When an appropriate time has been reached to switch from the first mode to a second mode, the outdoor heat exchanger portion of the data cooling system is switched to a second heat transfer fluid, which is a relatively low performance heat transfer fluid (compared to the first fluid). It has a second heat transfer fluid freezing point, lower than the first heat transfer fluid freezing point, and sufficiently low to operate without freezing when the outdoor air temperature drops below a first predetermined relationship with the first heat transfer fluid freezing point.

Data center coolant switch

A weight optimized stiffener for use in a semiconductor device is disclosed herein. In one example, the stiffener is made of AlSiC for its weight and thermal properties. An O-ring provides sealing between a top surface of the stiffener and a component of the semiconductor device and adhesive provides sealing between a bottom surface of the stiffener and another component of the semiconductor device. The stiffener provides warpage control for a lidless package while enabling direct liquid cooling of a chip or substrate.

Weight optimized stiffener and sealing structure for direct liquid cooled modules

Growing community of inventors

Woodstock, NY, United States of America

Madhusudan K Iyengar