Cisco Technology, Inc.

Madeline Marie Roemer

Joel Richard Goergen

D Brice Achkir

Alpesh Umakant Bhobe

Amendra Koul

David Nozadze

Jessica Kiefer

Mehmet Onder Cap

Scott Hinaga

Jerome Henry

Mahesh Daisy

A conductive signal transmission structure for a printed circuit includes a copper material and a graphene layer disposed within the copper material at a depth below a surface of the structure. The depth of the graphene layer is further within a skin depth region of the structure when a transmission signal applied to the conductive signal transmission structure has a signal speed of at least 112 Gbps and/or a Nyquist frequency that is at least about 14 gigahertz (GHz).

Integrating graphene into the skin depth region of high speed communications signals for a printed circuit board

An apparatus includes a printed circuit board (PCB), an integrated circuit (IC) component connected with a surface of the PCB, and a heat sink. The heat sink includes a base plate disposed directly over the IC component, and a plurality of cooling fins extending transversely from the base plate. The heat sink includes at least one component including a bimetallic material that distorts when heated above a threshold temperature so as to modify a flow of air directed toward and contacting the cooling fins or maintain contact between a surface of the IC component and a facing surface of the base plate.

Use of bimetals in a heat sink to benefit heat transfer from high temperature integrated circuit components on a circuit board

A conductive signal transmission structure for an electronic device (e.g., a printed circuit board of an electronic device) includes a copper material and a graphene layer disposed within the copper material at a depth below a surface of the structure. The depth of the graphene layer is further within a skin depth region of the structure when a transmission signal applied to the conductive signal transmission structure has a signal speed of at least 112 Gbps.

A conductive signal transmission structure for an electronic device (e.g., a printed circuit board of an electronic device) includes a copper material and a graphene layer disposed within the copper material at a depth below a surface of the structure. The depth of the graphene layer is further within a skin depth region of the structure when a transmission signal is applied to the structure that is in the GHz frequency range.

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Los Altos, CA, United States of America

Madeline Marie Roemer