Texas Instruments Corporation

Maciej Blasiak

Brian Goodlin

Nicholas Stephen Dellas

Neng Jiang

Thomas Warren Lassiter

Simon Y S Chang

Jerry Schlesinger

Jamie T Stapleton

Sean Trautman

Method of forming a termination angle in a titanium tungsten layer include providing a titanium tungsten layer and applying a photo resist material to the titanium tungsten layer. The photo resist material is exposed under a defocus condition to generate a resist mask, wherein an edge of the exposed photo resist material corresponds to the sloped termination. The titanium tungsten layer is etched with an etching material, wherein the etching material at least partially etches the photo resist material exposed under the defocused condition, and wherein the etching results in the sloped termination in the titanium tungsten layer.

Devices with specific termination angles in titanium tungsten layers and methods for fabricating the same

Method for fabricating specific termination angles in titanium tungsten layers

Methods and apparatus for forming structures to reduce wafer warpage. A method includes providing a semiconductor wafer having a plurality of integrated circuits; providing a photomask defining a plurality of cavities to be formed by an etch on a backside surface of the semiconductor wafer; defining structural support areas for the backside surface, the structural support areas being contiguous areas; providing areas on the photomask that correspond to the structural support areas, the structural support areas being areas that are not to be etched; using the photomask, performing an etch on the backside surface of the semiconductor wafer to form the cavities by removing semiconductor material from the backside surface of the semiconductor wafer; and the structural supports on the backside of the semiconductor wafer formed as areas that are not subjected to the etch. Additional methods and apparatus are also disclosed.

Methods and apparatus to reduce semiconductor wafer warpage in the presence of deep cavities

A method of forming a pattern in a photoresist layer which contains a dye that is insoluble in the developer solution is disclosed. A rinse liquid, typically deionized water, is dispensed onto the substrate while it is rotated at less than 750 rpm. The dye in the exposed regions is carried off by the rinse liquid, and does not accumulate in corners of exposed regions at the edge of the substrate due to centrifugal action.

DI water rinse of photoresists with insoluble dye content

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Plano, TX, United States of America

Maciej Blasiak