Cisco Technology, Inc.

M Onder Cap

Robert Gregory Twiss

Vic Hong Chia

Kevin Franklin Casey

Kurt Kordes

Baris Dogruoz

Steven Fleming

The subject disclosure relates to an integrated circuit package having an application specific integrated circuit, a high bandwidth memory, a first heat sink having a first footprint and a first path, and a second heat sink having a second footprint and a second path, wherein the second footprint does not exceed the first footprint. The thermal energy through the first path travels from the application specific integrated circuit to the first heat sink and thermal energy through the second path travel from the high bandwidth memory through one or more heat pipes to the second heat sink.

Cooling system for high power application specific integrated circuit with embedded high bandwidth memory

An EMI shield, or module cage, mounts to a circuit board such that a first portion of the module cage extends above a first planar surface of the circuit board and a second portion of the module cage extends below a second planar surface of the circuit board. The module cage surrounds a corresponding transceiver module and allows airflow to travel across the transceiver module and through the module cage in a direction substantially perpendicular to a planar surface of the circuit board to cool the transceiver module. In one arrangement, multiple module cages attach to the circuit board in a modular configuration. Such a configuration allows attachment, to the circuit board, of the number of module cages corresponding to the number of transceiver modules required or utilized by the circuit board.

Methods and apparatus for mounting an electromagnetic interference shielding cage to a circuit board

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Sunnyvale, CA, United States of America

M Onder Cap