Hewlett-Packard Development Company, L.p.

M Jeffery Igelman

Joseph Edward Scheffelin

Steven Warren Steinfield

Noah C Lassar

Brad Benson

Paul David Schweitzer

Frank J Bretl

Steve H Zhang

Ellen L Chappell

Carlos B W Garcia

Frank J Breti

Frank J c/o Hewlett-Packard Company Bretl

An electrical connection is encapsulated by dispensing an encapsulant on a first side of the electrical connection only, and directing the encapsulant to a second side of the electrical connection from the first side, where the second side generally faces opposite the first side.

Encapsulating electrical connections

An electronic device comprises a substrate and an electrical contact in contact with the dielectric layer and electrically coupled with at least one resistor, a substrate carrier including an electrical trace electrically coupled to the electrical contact, a polymer enclosing the electrical contact, and a substantially planar film disposed over the electrical contact.

Electrical contact encapsulation

In one embodiment, a fluid ejection device is configured to receive a signal and ejecting fluid in response thereto, including an ink ejecting nozzle layer having a substrate with first and second surfaces joined along an edge, an insulating feature located on the first surface adjacent the edge and a flexible lead that bends around the edge and lies flush against the insulating feature.

Fluid ejection device with insulating feature

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Corvallis, OR, United States of America

M Jeffery Igelman