Cisco Technology, Inc.

M Baris Dogruoz

Mandy Hin Lam

Joel Richard Goergen

Rakesh Chopra

Mark C Nowell

Mehmet Onder Cap

Yi Tang

D Brice Achkir

Vic Hong Chia

Paolo Sironi

Giovanni Giobbio

Robert Gregory Twiss

Douglas Paul Arduini

Sung Kee Baek

Richard Anthony O'Brien

Hong Huynh

Jessica Kiefer

Shobhana Punjabi

Elizabeth Kochuparambil

Pirooz Tooyserkani

Marc Henry Mantelli

Ashley Julia Maker Erickson

Giridharan Rajagopalan

John Beecroft

A combined liquid and air cooling system is provided over a printed circuit board (PCB) of an electronic device, where the PCB includes an integrated circuit package including an application specific integrated circuit (ASIC) die and a plurality of high bandwidth memory (HBM) modules located proximate the ASIC die, and the combined liquid and air cooling system includes a liquid cooling system located over the integrated circuit package and an air cooling system integrated with the liquid cooling system and a portion of the PCB. The system operates in a normal mode, where both liquid and air cooling systems provide cooling to components of the PCB, and a fail-safe mode, where the liquid cooling system is not operating (e.g., due to a detected condition) but the air cooling system operation is adjusted such that it provides sufficient cooling to PCB components which facilitates continuous operation of the electronic device.

Combined liquid and air cooling system for fail-safe operation of high power density ASIC devices

In one embodiment, a thermal management device includes a heat sink base and heat sink fins comprising a single element formed from a plurality of graphene layers with carbon nanotubes interposed between the graphene layers. A method is also disclosed herein.

Graphene and carbon nanotube based thermal management device

Presented herein is a plurality of arrangements of cold plates having interior chambers. The interior chamber includes a plurality of fins with a first fin zone and a second fin zone. The cold plate further includes a first fluid inlet and a first fluid outlet. The cold plates can be connected such that each cold plate allows unidirectional flow or counter flow configurations. Unidirectional flow or counter flow cold plates can be arranged in rows and in combination of rows.

Thermal management of high capacity optics in dense arrangements

A network communications device includes a chassis, a plurality of modules removably inserted into a plurality of slots in the chassis. A coolant is delivered to a first group of the plurality of modules with a first flow control valve in a first cooling loop and the coolant is delivered to a second group of the plurality of modules with a second flow control valve in a second cooling loop. The network communication device further includes a plurality of sensors for monitoring a temperature in the first cooling loop and the second cooling loop and a control system for controlling delivery of the coolant to the first group and the second group, where the control system controls transmitting a signal to one of the first flow control valve and the second flow control valve to modify a flow of the coolant.

Liquid cooling distribution in a modular electronic system

In one embodiment, an apparatus includes an enclosure configured for connection to a printed circuit board, a substrate within the enclosure, a plurality of components mounted on the substrate, a fluid inlet connector, a fluid outlet connector, and a plurality of flow channels within the enclosure, at least one of the components disposed in each the flow channels and segregated from other components in another of the flow channels. The enclosure is configured for immersion cooling of the components.

Localized immersion cooling enclosure with thermal efficiency features

A housing for an electronic device includes a panel, where the panel includes a window. A cage includes a plurality of panels and a first end and a second end that opposes the first end. The cage further includes an opening at its first end and an enclosure disposed between the panels of the cage. Connecting structure is disposed at the first end of the cage, where the connecting structure secures the first end of the cage to the panel. The cage is suitably dimensioned to receive and retain a portion of a pluggable module within the enclosure when the pluggable module is inserted within the opening at the first end of the cage.

Optical module cages mounted for optimal density and cooling

In one embodiment, an apparatus is configured for insertion into a network device and includes a printed circuit board, at least one electronic component mounted on the printed circuit board and configured for direct air-cooling, and an enclosure comprising a plurality of electronic components, an electrical connector, a fluid inlet connector, and a fluid outlet connector. A dielectric liquid is disposed within the enclosure for immersion cooling of said plurality of electronic components during operation of the network device.

Localized immersion cooling enclosure

A housing for an electronic device includes a panel, where the panel includes a window. A cage includes a plurality of panels and a first end and a second end that opposes the first end. The cage further includes an opening at its first end and an enclosure disposed between the panels of the cage. Connecting structure is disposed at the first end of the cage, where the connecting structure secures the first end of the cage to the panel. The cage is suitably dimensioned to receive and retain a portion of an optical module within the enclosure when the optical module is inserted within the opening at the first end of the cage.

Presented herein are optical module cage designs and heatsink configurations for improved air cooling of pluggable optical modules disposed within the optical module cages. The designs and configurations presented herein facilitate efficient air cooling of higher power pluggable optical modules by enhancing airflow through the optical module cages, increasing contact between the optical modules and the heatsinks, and/or increasing the heatsink dissipation surface area.

Air cooled cage design

In one embodiment, an apparatus includes a substrate comprising a first surface and a second surface opposite to the first surface, an integrated circuit attached to the first surface of the substrate, and a cold plate attached to the second surface of the substrate with an electrical path extending through the cold plate for transmitting power from a power component connected to the cold plate, to the integrated circuit.

Growing community of inventors

Santa Clara, CA, United States of America

M Baris Dogruoz