Hughes Electronics Corporation

Hughes Aircraft Company

M Akbar Ali

Carl W Peterson

Bruce W Buller

Hutan Taghavi

Kevin M McNab

A packaged electronic structure includes an electronic device, and a package to which the electronic device is affixed. At least a portion of the package is made of a composite material of aluminum nitride dispersed in aluminum. The composite material is preferably prepared by mixing powders of the aluminum nitride and aluminum, and thereafter pressing and sintering the mixture.

Electronic package structure utilizing aluminum nitride/aluminum composite material

An electronic structure includes an electronic device, and a heat sink assembly in thermal contact with the electronic device. The heat sink assembly is formed of a piece of pyrolytic graphite embedded within a metallic casing and intimately contacting an interior wall of the metallic casing. The heat sink assembly is substantially fully dense. The heat sink assembly is fabricated by assembling the piece of pyrolytic graphite within the disassembled elements of the metallic casing, and then simultaneously heating and pressing the initial assembly until it is substantially fully dense.

Electronic structure having an embedded pyrolytic graphite heat sink

Method of making an electronic package structure utilizing aluminum

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Lomita, CA, United States of America

M Akbar Ali