Georgia Tech Research Corporation

Cda Procesing Limited Liability Company

Lynne E Dellis

David Ross McGregor

Venkatesh V Sundaram

Karl Hartmann Dietz

Deepukumar M Nair

Fuhan Liu

Cheong-Wo Hunter Chan

Disclosed are methods of making a semiconductor package comprising at least one thin-film capacitor embedded into at least one build-up layer of said semiconductor package. A thin-film capacitor is provided wherein the thin-film capacitor has a first electrode and a second electrode separated by a dielectric. A temporary carrier layer is applied to the first electrode and the second electrode is patterned. A PWB core and a build-up material are provided, and the build-up material is placed between the PWB core and the patterned second electrode of said thin-film capacitor. The patterned electrode side of the thin-film capacitor is laminated to the PWB core by way of the build-up material, the temporary carrier layer is removed, and the first electrode is patterned.

Methods of embedding thin-film capacitors into semiconductor packages using temporary carrier layers

Provided are semiconductor packages comprising at least one thin-film capacitor attached to a printed wiring board core through build-up layers, wherein a first electrode of the thin-film capacitor comprises a thin nickel foil, a second electrode of the thin-film capacitor comprises a copper electrode, and a copper layer is formed on the nickel foil. The interconnections between the thin-film capacitor and the semiconductor device provide a low inductance path to transfer charge to and from the semiconductor device. Also provided are methods for fabricating such semiconductor packages.

Thin-film capacitor structures embedded in semiconductor packages and methods of making

Growing community of inventors

Willow Spring, NC, United States of America

Lynne E Dellis