Siemens Components, Inc.

Siemens Microelectronics Limited

Infineon Technologies LLC

Lynn Wiese

David L Whitney

A data access arrangement (DAA) that includes a substrate and an optically-active component disposed on the substrate. The component is encapsulated with a radiation-transmissive material to form an optical medium. The DAA also includes a layer of opaque material disposed around the substrate and the optically-active component so that the substrate and the component are sealed from the outside environment. A lead frame is attached to the substrate that extends through and beyond the opaque material layer to enable electrical contact with the substrate and the component.

Optical semiconductor device having plural encapsulating layers

Illumination apparatus for use in localized illumination applications, such as an automobile dashboard. The apparatus includes a light emitting diode mounted on a metallized circuit board; a TIR lens mounted over the light emitting diode to collect light emitted from the light emitting diode and to direct the light in a single direction; and a light pipe disposed over the light emitting diode and the TIR lens. The light pipe has walls extending from the circuit board to a plane above the circuit board such that directed light from the TIR lens is channeled through the light pipe to the plane. The apparatus can also include a cover disposed in the plane over the light pipe. The cover may be integrally molded to the light pipe and have an icon configured therein, such that the icon is illuminated by the light from the light emitting diode. A lens may also be placed over the cover of the light pipe to create a focused image of the icon, thereby maximizing the light emitted by the light emitting diode at the focused image.

Localized illumination device

A method of illuminating an object by capturing light from a light source with a TIR lens, redirecting the captured light from the light source in a single direction using the TIR lens, and channeling the redirected light through a light pipe to a plane at or before the object to maximize brightness of the light from the light source at the plane.

Localized illumination using TIR technology

A method of making a data access arrangement (DAA) device. The method includes providing a substrate with a DAA circuit, containing optically active electrical components, mounted on it and individually encapsulating each optically active component with an optical medium. An opaque material is transfer molded about the substrate to completely encase the substrate and all of the circuit components. Before the transfer molding, a lead frame is attached to the substrate that extends through and beyond the opaque material to enable electrical contact with the substrate and the circuit components.

Method of manufacturing a semiconductor device

An optically-triggered silicon controlled rectifier (SCR) device (21) mounted on a lead frame (34). The SCR device contains a cathode layer (24), an optical gate or control layer (23), and an anode layer (31) formed on a semiconductor substrate (22). The device is soldered onto a pedestal (33) formed on the lead frame. To connect the device to the lead frame, solder is deposited upon the anode layer and the solder fixes the anode layer to the pedestal on the lead frame. The pedestal may be formed by etching or stamping a depression (35) in the lead frame. The device is centered on the pedestal such that the edges of the device are located adjacent the depression, and are spaced from the lead frame.

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Santa Clara, CA, United States of America

Lynn Wiese