Nlight, Incorporated

Electro Scientific Industries, Inc.

Lynn Sheehan

Dahv A V Kliner

Brian Victor

Roger L Farrow

Robert J Martinsen

Daragh Finn

Kelly Bruland

Aaron W Brown

David Barsic

William J Jordens

Yasu Osako

Xiaoyuan Peng

Andrew Edwin Hooper

Andy E Hooper

Tim Webb

Kenneth Pettigrew

Yu Chong Tai

Jim Dumestre

Dahv AV Kliner

Methods, apparatus, and systems comprising a fiber-coupled laser and time-varying beam characteristics. A laser may generate an optical beam that is launched into one or more lengths of fiber, at least one of which comprises a confinement region that is optically coupled to an output. A perturbation device may modulate, through action upon the one or more lengths of fiber, a beam characteristic over a time period during which the laser is energized. A controller may cause the perturbation device to act upon the one or more lengths of fiber to impart a time-averaged beam characteristic and/or to induce a continuous variation in one or more beam characteristics during system use. A process monitor may sense a metric external to the optical system, and a feedback signal from the process monitor may be coupled into the controller. Dynamic beam characteristics may be modulated based on the feedback signal.

Fiber-coupled laser with time varying beam characteristics

A method for forming an article includes providing a material having a first material property; forming a melt pool by exposing the material to an optical beam having at least one beam characteristic, wherein the melt pool has at least one melt pool property determinative of a second material property of the material; and modifying the at least one beam characteristic in response to a change in the melt pool property.

Use of variable beam parameters to control solidification of a material

A method for forming an article includes: forming a melt pool; exposing the melt pool to an optical beam having at least one beam characteristic; forming a keyhole cavity in the melt pool, the keyhole cavity having at least one keyhole cavity property; and modifying the at least one beam characteristic in response to a change in the keyhole cavity property.

Use of variable beam parameters to control a melt pool

A method of forming an aperture (e.g., a through via, a blind via, a trench, an alignment feature, etc.) within a substrate includes irradiating a substrate with a laser beam to form a laser-machined feature having a sidewall. The laser-machined feature is then processed to change at least one characteristic (e.g., the sidewall surface roughness, diameter, taper, aspect ratio, cross-sectional profile, etc.) of the laser-machined feature. The laser-machined feature can be processed to form the aperture by performing an isotropic wet-etch process employing an etchant solution containing HNO, HF and, optionally acetic acid.

Substrate containing aperture and methods of forming the same

Tailored laser pulse shapes are used for processing workpieces. Laser dicing of semiconductor device wafers on die-attach film (DAF), for example, may use different tailored laser pulse shapes for scribing device layers down to a semiconductor substrate, dicing the semiconductor substrate, cutting the underlying DAF, and/or post processing of the upper die edges to increase die break strength. Different mono-shape laser pulse trains may be used for respective recipe steps or passes of a laser beam over a scribe line. In another embodiment, scribing a semiconductor device wafer includes only a single pass of a laser beam along a scribe line using a mixed-shape laser pulse train that includes at least two laser pulses that are different than one another. In addition, or in other embodiments, one or more tailored pulse shapes may be selected and provided to the workpiece on-the-fly. The selection may be based on sensor feedback.

Methods and systems for laser processing a workpiece using a plurality of tailored laser pulse shapes

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Vancouver, WA, United States of America

Lynn Sheehan