Artisan Components, Inc.

Synopsys, Inc.

Ciranova, Inc.

Lyndon Charles Lim

Dhrumil Gandhi

Lindor E Henrickson

Edwin Simon Petrus

Felix Sun-Tsyr Wu

An automated layout method allows designing advanced integrated circuits with design rules of high complexity. In particular, a hierarchical constrained layout process is applicable and useful for analog and mixed-signal integrated circuit designs and may be based on an incremental concurrent placement and routing. Use of constraints from multiple levels of a circuit description hierarchy allows computationally efficient processing of logical circuit increments and produces high-quality outcomes. Users such as circuit designers can exercise a high degree of predictability and control over the resulting physical layout construction by either user-specified or computer-generated constraints.

Concurrent placement and routing using hierarchical constraints

Systems and methods of laying out integrated circuits are disclosed. During the layout stage of an integrated circuit device, a fixed, physical geometry is created of the parameterized cells (PCells) included in the integrated circuit schematic. The systems include a proxy engine configured to save to cache the geometries created during the layout stage such that the geometries need not be recomputed when the design is opened after a save to disk operation, during which geometries may otherwise be destroyed. The proxy engine may further be configured to delegate requests for the creation of geometries to other components of the integrated circuit design system. In addition, the proxy engine may be configured to perform customized evaluations of PCells, other than or in addition to caching and delegation.

System and method for proxied evaluation of PCells

Disclosed is a semiconductor standard cell architecture with local interconnect. The standard cell architecture includes a semiconductor substrate having diffusion regions that are designated for source and drain regions of a functional circuit. The standard cell also includes a polysilicon layer that is patterned to define gate electrodes and interconnections of the semiconductor standard cell architecture. In addition, the standard cell includes a local interconnect metallization layer that is patterned into a plurality of local interconnect metallization lines that are configured to be disposed over the semiconductor substrate and are further configured to substantially interconnect the source and drain regions and gate electrodes to define the functional circuit. The plurality of local interconnect metallization lines are further designed to incorporate local interconnect metallization pins that are connection points for interconnecting the functional circuit to another functional circuit. In a preferred embodiment, the local interconnect metallization lines are configured to be fabricated from a higher resistivity metal having a resistivity that is greater than aluminum containing metals.

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San Jose, CA, United States of America

Lyndon Charles Lim