E.i. Dupont De Nemours and Company

The University of North Carolina at Chapel Hill

Other

California Institute of Technology

Dow Global Technolgoies LLC

E. I. Du Pont Nemours and Co.

E.i. Du Pont De Nmeours and Company

Performance Materials Na, Inc.

Lynda Kaye Johnson

Maurice S Brookhart

Elizabeth Forrester McCord

Lin Wang

Christopher Moore Killian

Stephan James McLain

Steven Dale Ittel

Samuel David Arthur

Feng Gao

Jeffrey Scott Meth

Jerald Feldman

Rinaldo Soria Schiffino

Kristina Ann Kreutzer

Graciela Beatriz Blanchet

Irina Malajovich

Richard Kevin Bailey

Alex Sergey Ionkin

Reid John Chesterfield

Edward Bryan Coughlin

Anju Parthasarathy

John W Catron, Jr

Ying Wang

Roupen Leon Keusseyan

Gary Delmar Jaycox

Kenneth George Sharp

Alison Margaret Anne Bennett

Geoffrey Nunes

Marc Bruce Goldfinger

Yueli Wang

Alison Margaret Bennett

Daniel Joseph Tempel

Robert H Grubbs

Jonathan V Caspar

Gerald Donald Andrews

Elisabeth Muriel Hauptman

Dalen E Keys

Sonbinh T Nguyen

Thomas C Felder

Gerard O'Neil

Daniela Rodica Radu

Peter Arnold Morken

Fredrick Claus Zumsteg, Jr

Nancy G Tassi

William J Marshall

Catherine E Radzewich

Wilson Tam

Paul J Shannon

Joel David Citron

Zhen-Yu Yang

Hong Meng

Howard David Glicksman

Dennis S Donald

Charles Nehemiah McEwen

Keith Joseph Kunitsky

Meijun Lu

Karl Jeffery Sweetman

Robert D Simpson

Jordan Lawrence Bennett

Xing Shen

Lissa Taka Nelson

Stephan J Mclain

Weijun Liu

Jon M Malinoski

Lissa Taka Jennings Nelson

Mark Andrew Harmer

Frank L Schadt, Iii

Zhibin Guan

Karyn B Visscher

Kerwin D Dobbs

H David Rosenfeld

Michael Karl Crawford

Frank S Principe

Patricia Metzger Cotts

Karl Jeffrey Sweetman

Larry L Berger

Michael S Denny

Cheng-Yu Lai

John Catron

Charles Nehemiah McEwan

Elisabeth M Hauptman

Robert Mar Yohannan

Yanyan Cao

Seema Agrawal

Fredrick Claus Zumsteg Jr

Gerald D Andrews

The disclosure generally relates to 3D printed articles prepared from filaments comprising an ionomer (A) prepared from a base resin (B); wherein: base resin (B) is prepared from ethylene and at least one Cto C&#x3b1;,&#x3b2; ethylenically unsaturated carboxylic acid monomer; the carboxylic acid moieties of base resin (B) are 10 to 99.5 percent neutralized by zinc or lithium; the at least one Cto C&#x3b1;,&#x3b2; ethylenically unsaturated carboxylic acid is present from about 2 weight percent to about 30 weight percent, based on the weight of base resin (B).

Filaments comprising ionomers and use in fused filament fabrication

This invention relates to ink compositions useful for preparing films of CTS and CZTS and their selenium analogues on a substrate. Such films are useful in the preparation of photovoltaic devices.

Copper tin sulfide and copper zinc tin sulfide ink compositions

The present invention relates to coated binary and ternary chalcogenide nanoparticle compositions that can be used as copper zinc tin chalcogenide precursor inks. In addition, this invention relates to coated substrates comprising binary and ternary chalcogenide nanoparticle compositions and provides processes for manufacturing these coated substrates. This invention also relates to compositions of copper zinc tin chalcogenide thin films and photovoltaic cells comprising such films. In addition, this invention provides processes for manufacturing copper zinc tin chalcogenide thin films, as well as processes for manufacturing photovoltaic cells incorporating such films.

CZTS/Se precursor inks and methods for preparing CZTS/Se thin films and CZTS/Se-based photovoltaic cells

The present invention relates to aqueous processes to make metal chalcogenide nanoparticles that are useful precursors to copper zinc tin sulfide/selenide and copper tin sulfide/selenide. In addition, this invention provides processes for preparing crystalline particles from the metal chalcogenide nanoparticles, as well as processes for preparing inks from both the metal chalcogenide nanoparticles and the crystalline particles.

Aqueous process for producing crystalline copper chalcogenide nanoparticles, the nanoparticles so-produced, and inks and coated substrates incorporating the nanoparticles

Thermal imaging donors are useful for thermal transfer patterning of a metal layer and optionally, a corresponding proximate portion of an additional transfer layer onto a thermal imaging receiver. The compositions are useful for dry fabrication of electronic devices. Also provided are patterned multilayer compositions comprising one or more base film(s), and one or more patterned metal layers. These include electromagnetic interference shields and touchpad sensors.

Metal compositions, thermal imaging donors and patterned multilayer compositions derived therefrom

The invention is related to thermal imageable dielectric layers and thermal transfer donors and receivers comprising dielectric layers. The thermal transfer donors are useful in making electronic devices by thermal transfer of dielectric layers having excellent resistivity, good transfer properties and good adhesion to a variety of receivers.

Thermally imageable dielectric layers, thermal transfer donors and receivers

This invention relates to processes for making kesterite compositions with atypical Cu:Zn:Sn:S ratios and/or kesterite compositions with unusually small coherent domain sizes. This invention also relates to these kesterite compositions and their use in preparing CZTS films.

Atypical kesterite compositions

The invention discloses processes for thermal transfer patterning of a nanoparticle layer and a corresponding proximate portion of a carrier layer, and optionally additional transfer layers, together onto a thermal imaging receiver. The invention is useful for dry fabrication of electronic devices. Additional embodiments of the invention include multilayer thermal imaging donors comprising in layered sequence: a base film, a carrier layer and a nanoparticle layer. The carrier layer can be a dielectric or conducting layer. When the carrier layer is a dielectric layer, the base film includes a light attenuating agent in the form of a dye or pigment.

Donor elements and processes for thermal transfer of nanoparticle layers

The invention relates to thin film transistors comprising novel dielectric layers and novel electrodes comprising metal compositions that can be provided by a dry thermal transfer process.

Thin film transistor comprising novel conductor and dielectric compositions

Ethylene and allyl- or vinylsilanes are efficiently copolymerized by certain late transition metal complexes containing selected bidentate or tridentate ligands. The resulting novel polymers may be crosslinked by moisture when vinylsilane contains groups bound to silicon which are hydrolyzable. The polymers are useful for wire coating, crosslinked foams, pipes, and other uses.

Copolymers of vinyl- and allylsilanes

Transition metal complexes of selected monoanionic phosphine ligands, which also contain a selected Group 15 or 16 (IUPAC) element and which are coordinated to a Group 3 to 11 (IUPAC) transition metal or a lanthanide metal, are polymerization catalysts for the (co)polymerization of olefins such as ethylene and &#x3b1;-olefins, and the copolymerization of such olefins with polar group-containing olefins. These and other nickel complexes of neutral and monoanionic bidentate ligands copolymerize ethylene and polar comonomers, especially acrylates, at relatively high ethylene pressures and surprisingly high temperatures, and give good incorporation of the polar comonomers and good polymer productivity. These copolymers are often unique structures, which are described.

Catalysts for olefin polymerization

Metal compositions including silver compositions are used in preparing thermal imaging donors. The donors are useful for thermal transfer patterning of a metal layer and optionally, a corresponding proximate portion of an additional transfer layer onto a thermal imaging receiver. The compositions are useful for dry fabrication of electronic devices. Also provided are patterned multilayer compositions comprising one or more base film(s), and one or more patterned metal layers, including EMI shields and touchpad sensors.

Provided are processes for enhancing the resolution of a thermally transferred pattern on an imaged thermal transfer receiver, wherein the imaged thermal transfer receiver comprises a surface having an exposed portion and a non-exposed portion of one or more thermally transferred layer(s), comprising: (a) contacting said surface with an adhesive layer for a contact period to provide a laminate; (b) separating said adhesive layer from the laminate to provide a treated thermal transfer receiver having a surface substantially free of said non-exposed portion of one or more thermally transferred layer(s). The processes are useful in the fabrication of electronic devices including thin film transistors, circuits, electromagnetic interference shields, touchpad sensors and other electronic devices.

Process for enhancing the resolution of a thermally transferred pattern

Novel iron and cobalt complexes of certain novel tricyclic ligands containing a 'pyridine' ring and substituted with two imino groups are polymerization and/or oligomerization catalysts for olefins, especially ethylene. Depending on the exact structure of the ligand, and polymerization process conditions, products ranging from &#x3b1;-olefins to high polymers may be produced. The polymers, especially polyethylenes, are useful for films and as molding resins.

Catalysts for olefin polymerization or oligomerization

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Wilmington, DE, United States of America

Lynda Kaye Johnson