Agiltron Corporation

Intellisense Software Corporation

Luzhong Yin

Jing Zhao

Guanghai Jin

Guixiong Zhong

Jun Yan

Yuanxin Shou

Sandeep Akkaraju

John Gardner Bloomsburgh

Yie He

Yi He

Amit Ghosh

The present disclosure provides a displacement amplification structure and a method for controlling displacement. In one aspect, the displacement amplification structure of the present disclosure includes a first beam and a second beam substantially parallel to the first beam, an end of the first beam coupled to a fixture site, and an end of the second beam coupled to a motion actuator; and a motion shutter coupled to an opposing end of the first and second beams. In response to a displacement of the motion actuator along an axis direction of the second beam, the motion shutter displaces a distance along a transversal direction substantially perpendicular to the axis direction.

Microelectromechanical displacement structure and method for controlling displacement

The present disclosure provides a displacement amplification structure and a method for controlling displacement. In one aspect, the displacement amplification structure of the present disclosure includes a first beam and a second beam substantially parallel to the first beam, an end of the first beam coupled to a fixture site, an end of the second beam coupled to a motion actuator, and a motion shutter coupled to an opposing end of the first and second beams. In response to a displacement of the motion actuator along an axis direction of the second beam, the motion shutter displaces a distance along a transversal direction substantially perpendicular to the axis direction.

A system having a MEMS variable optical attenuator (VOA) that has an improved optical shutter for regulating the optical power of an optical signal by partially intercepting incident light beams and a negative temperature coefficient component that is electrical connected in series with a voltage source that drives the MEMS variable optical attenuator (VOA) is disclosed.

System and method for compensating thermal dependent loss in variable optical attenuators

A MEMS variable optical attenuator (VOA) chip includes a frame having a planar surface, a micro-electric actuator with a movable optical shutter arranged with respect to the planar surface of the frame, where the VOA is actuated by thermal expansion. The micro-electric actuator comprises semiconductor conductors ('wires') that can be moved, upon applying an electrical current, by thermal expansion. In one embodiment, the MEMS VOA chip is configured in a multiple wire arrangement that restricts the shutter movement in a plane.

Compact thermal actuated variable optical attenuator

An optical switch including a bistable component, a reflective component, the reflective component being operatively connected to the bistable component, a first electrothermal bent beam actuator, a first contacting component operatively connected to the first electrothermal bent beam actuator component, the first electrothermal bent beam actuator component and the first contacting component disposed such as to enable advancing the bistable component the reflective component from a first stable configuration to a second stable configuration, a second electrothermal bent beam actuator component and a second contacting component operatively connected to the second electrothermal bent beam actuator component, the second electrothermal bent beam actuator component and the second contacting component disposed such as to enable advancing the bistable component and the reflective component from the second stable configuration to the first stable configuration.

MEMS bistable optical switch and methods for use thereof

A method and apparatus for sensing accelerations directed along multiple directions are provided. An embodiment comprises a sensor array comprising two sensor pairs, each of which provides an output signal based on acceleration along two orthogonal directions. The sensor pairs are so that they collectively provide an output signal for each of three mutually orthogonal directions. In some embodiments, the sensor array is augmented to provide three additional signals, each of which is based on rotation about an axis aligned with one of the three orthogonal directions.

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Woburn, MA, United States of America

Luzhong Yin