Atotech Deutschland Gmbh

Atotech Deutschalnd Gmbh

Lutz Stamp

Heinrich Meyer

Gonzalo Urrutia Desmaison

Lutz Brandt

Hans-Jürgen Schreier

Thomas Thomas

Christian Wendeln

Bexy Dosse

Kay Wurdinger

Regina Czeczka

Elisabeth Zettelmeyer-Decker

Merten Piel

Elisabeth Zettelmeyer

Brigitte Steder, Legal Representative

Tang Cam Lai Nguyen

Rolf Piel, Legal Representative

Norbert Tiemann

Gerson Krilles

Edith Steinhäuser

Elke Piel, Legal Representative

Christiane Moepert

Laurence John Gregoriades

Stefanie Wiese

Julia Schiemann

A process for depositing metal or metal alloy on a substrate including treating the substrate surface with an activation solution comprising a source of metal ions so the metal ions are adsorbed on the substrate surface, treating the obtained substrate surface with a treatment solution containing an additive selected from thiols, thioethers, disulphides and sulphur containing heterocycles, and a reducing agent suitable to reduce the metal ions adsorbed on the substrate surface selected from boron based reducing agents, hypophosphite ions, hydrazine and hydrazine derivatives, ascorbic acid, iso-ascorbic acid, sources of formaldehyde, glyoxylic acid, sources of glyoxylic acid, glycolic acid, formic acid, sugars, and salts of aforementioned acids; and subsequently treating the substrate surface with a metallizing solution comprising a source of metal ions to be deposited such that a metal or metal alloy is deposited thereon.

Process for depositing a metal or metal alloy on a surface of a substrate including its activation

A method is provided for metallization of substrates providing a high adhesion of the deposited metal to the substrate material and thereby forming a durable bond. The method applies novel adhesion promoting agents comprising nanometer-sized particles prior to metallization. The particles have at least one attachment group bearing a functional chemical group suitable for binding to the substrate.

Adhesion promoting agents for metallization of substrate surfaces

The invention relates to a control of etching processes of insulating substrates by means of gloss measurement. By this method a surface roughness can be achieved which leads to good adhesion of metals layers deposited in subsequent metallization steps. This method is particularly suited for the production of printed circuit boards.

Method for metallizing insulating substrates wherein the roughening and etching processes are controlled by means of gloss measurement

The invention relates to a method for the direct electrolytic metallization of electrically non-conducting substrate surfaces comprising bringing the substrate surfaces into contact with a water-soluble polymer; treating the substrate surfaces with a permanganate solution; treating the substrate surfaces with an acidic aqueous solution or an acidic microemulsion of aqueous base containing at least one thiophene compound and at least one alkane sulfonic acid selected from the group comprising methane sulfonic acid, ethane sulfonic acid and ethane disulfonic acid; electrolytically metallizing the substrate surfaces.

Direct electrolytic metallization on non-conducting substrates

The invention relates to a palladium colloid solution, which, in addition to a palladium compound, a protective colloid for stabilizing the colloid and a reducing agent, additionally contains noble metals from the group rhodium, iridium and platinum. The solution can be used to treat electrically non-conductive substrate surfaces, particularly in order to metallize the substrate surfaces directly and electrolytically. By means of this method, the nonconductive areas of the holes in printed circuit boards can be directly electrolytically metallized.

Palladium colloid solution and its utilization

Complex compounds are disclosed comprising a metal of the 8th to 11th groups of the Periodic Table with at least one organic ligand, wherein the complex exists in an oligomeric or polymeric form, and the organic ligand preferably contains at least one N or O atom, or a multiple bond, or several of these elements. The complex compounds are useful for the generation of metal seeds on a non-metallic substrate.

Complex oligomeric or polymeric compounds for the generation of metal

A process for applying a principal metal coating to a non-conductive substrate without employing an electroless coating is disclosed comprising:

Process for the metallization of nonconductive substrates with

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Berlin, Germany

Lutz Stamp