Siemens Aktiengesellschaft

Lutz Namyslo

Benno Weis

Rainer Sommer

Bernd Kürten

Norbert Benesch

Eric Baudelot

Jens Schmenger

Thomas Schwinn

Bernd Roppelt

Daniel Kappauf

Felix Zeyss

Silvio Höhne

Roman Kögler

Robert Gospos

Michael Endres

Pietro Botazzoli

Roman KÖGLER

A heat sink assembly for semiconductor components includes a first and second heat sinks, each having a component and cooling fin side, which is provided with cooling fins arranged one behind another such that a cooling medium initially flows in a flow direction through cooling channels formed by the cooling fins of the first heat sink and subsequently flows through cooling channels formed by the cooling fins of the second heat sink, wherein a first inlet cross-section which, on an inlet side of the first heat sink, composed of individual cross-sections of the associated cooling channels of the first heat sink, is reduced via a partition partially covering the cooling channels on the inlet side of the first heat sink, and a second inlet cross-section which, on an inlet side of the second heat sink, is composed of individual cross-sections of the associated cooling channels of the second heat sink.

Heat sink assembly and power converter assembly

A power converter arrangement includes semiconductor arrangements for two motors, wherein a control unit is used to continuously form a sum current composed of a first current and a second current and the sum current is compared with a predeterminable maximum value in order to protect the motors from being destroyed, where the control unit includes a device in which a priority grade is input by a user, where the priority grade describes the priority of one of the two machines, and where the control unit reduces the current of the respective machine that lacks priority according to the priority grade when the maximum value is exceeded.

Power converter arrangement

A power module includes at least two power semiconductor arrangements, each having at least one semiconductor component, in contact with substrate and arranged in a housing. To improve the reliability of the power module, a first power connector and a second power connector are arranged on a first side of the housing and at least one other power connector is arranged on an opposing second side of the housing. Supply lines extending from the power connectors to the power semiconductor arrangements are arranged on the substrate in such a manner that electrical current is provided in a symmetrical manner.

Power module having at least two power semiconductor arrangements that are contacted on a substrate

A support for at least one electrical component includes a heat sink having a heat sink surface and two opposing lateral walls protruding from the heat sink surface. The heat sink includes a base body made of aluminum and a copper layer as a heat spreading layer which forms the heat sink surface. The copper layer is produced together with the base body through continuous casting, or with the copper layer being applied additively through cold gas spraying to a surface of the base body. Two spaced-apart sealing blocks lie on the heat sink surface, with each of the two sealing blocks extending between the two lateral walls and contacting the two lateral walls. A support structure is arranged on the heat sink surface between the two sealing blocks.

Support for electric components

A substrate and a first circuit board each have an upper side and a lower side. The substrate lower side is connected to a cooling body. On the upper side of the substrate, first electronic switching elements connect an alternating current potential at a phase terminal to a high direct current potential at a first potential terminal and to a low direct current potential at a second potential terminal. Second electronic switching elements connect the alternating current potential to a middle direct current potential at a third potential terminal. The substrate is spaced from the first circuit board under the first circuit board lower side. The upper side of the substrate faces toward the first circuit board. The second switching elements are at least on the upper side of the first circuit board, possibly additionally also on the lower side of the first circuit board.

Multilevel power converter with optimized topology

The suitable representation of information on the outside of an apparatus is intended to be simplified. For this purpose, an arrangement having an apparatus () and a display device (), which has electronic paper and is fastened to the apparatus, is provided. The display device () has a localization module which can be used to determine an item of country information relating to that country in which the arrangement is currently situated. The display device () is also designed to represent predefined data relating to the apparatus specifically on the basis of the country information.

Representation of specific information on an apparatus

In a method for synchronizing a feed voltage with a network voltage of an electrical energy supply network, a property of the feed voltage can be determined on the basis of a static characteristic curve. The static characteristic curve is compared to the property of the feed voltage of a feed power received by the electrical energy supply network at the applied feed voltage. The property of the feed voltage is adjusted to a specified value when a limit current of the feed power is reached.

Growing community of inventors

Hausen, Germany

Lutz Namyslo