Atotech Deutschland Gmbh

Atotech Deutschland Gmbh & Co. Kg

Lutz Brandt

Zhiming Liu

Lutz Stamp

Dirk Tews

Hans-Jürgen Schreier

Thomas Thomas

Fabian Michalik

Kay Wurdinger

Tafadzwa Magaya

Sara Hunegnaw

Frank Bruening

Kwonil Kim

Hailuo Fu

Lee Gaherty

Therese Stern

Kenichiroh Mukai

Constanze Donner

Guenther Bauer

Meng Che Hsieh

Belen Gil IBÀNEZ

Liu Zhiming

A method is provided for metallisation of non-conductive substrates providing a high adhesion of the deposited metal to the substrate material and thereby forming a durable bond. The method applies a metal oxide adhesion promoter which is activated and then metal plated. The method provides high adhesion of the non-conductive substrate to the plated metal layer.

Adhesion promoting process for metallisation of substrate surfaces

The present invention concerns a method for forming a metal layer for electromagnetic shielding and thermal management of active components, preferably by wet chemical metal plating, using an adhesion promotion layer on the layer of molding compound and forming at least one metal layer on the adhesion promotion layer or forming at least one metal layer on the adhesion promotion layer by wet chemical metal plating processes.

Method for electromagnetic shielding and thermal management of active components

A method is provided for metallization of substrates providing a high adhesion of the deposited metal to the substrate material and thereby forming a durable bond. The method applies novel adhesion promoting agents comprising nanometer-sized particles prior to metallization. The particles have at least one attachment group bearing a functional chemical group suitable for binding to the substrate.

Adhesion promoting agents for metallization of substrate surfaces

The present invention describes a method for the measurement of the stabilizer additive concentration in electroless metal and metal alloy plating electrolytes comprising a voltammetric measurement. Said method comprises the steps a. conditioning of the working electrode, b. interaction of intermediates on the working electrode, c. measurement of the Faradaic current and d. determining the Faradaic current.

Method for control of stabilizer additives in electroless metal and metal alloy plating electrolytes

Growing community of inventors

Berlin, Germany

Lutz Brandt