Huawei Technologies Co., Limited

Luqi Zhang

Rui Lyu

Kun Li

Yu Liu

Xin Xiao

Xin Luo

Yanxing Luo

Xianfeng Tang

This disclosure provides a radio frequency chip, a signal transceiver, and a communication device. The radio frequency chip includes: a chip; a coupling structure, including: a resonator, where a resonant cavity is formed, and an inner wall of the resonant cavity is made of metal; a redistribution layer, arranged above the resonant cavity and including an redistribution layer (RDL) dielectric layer; a radiator, made of metal, formed into a centro-symmetric shape, arranged on a surface that is of the dielectric layer and that faces the resonator, and accommodated in the resonant cavity; a feeder, where one end of the feeder is connected to the chip, and the other end is inserted into the resonant cavity; a packaging structure, configured to package the chip and cover the redistribution layer, so that a signal generated by the chip can be efficiently coupled to a polymer transmission line.

Radio frequency chip, signal transceiver, and communication device

A distributed radar includes a control unit, a receive antenna, and N transmit antennas. The N transmit antennas include a first transmit antenna, a second transmit antenna, and a third transmit antenna. There are a first distance between the first transmit antenna and the second transmit antenna, and a second distance between the first transmit antenna and the third transmit antenna, and the first distance is shorter than the second distance. The second transmit antenna is connected to the control unit by using a first cable, the third transmit antenna is connected to the control unit by using a second cable, a ratio of the first distance to the second distance is a first ratio, a ratio of a length of the first cable to a length of the second cable is a second ratio, and the second ratio is greater than the first ratio.

Distributed radar

The present disclosure describes a terahertz carrier sending apparatus and a terahertz carrier receiving apparatus. The sending apparatus includes a radio frequency sending chip, a mode conversion structure, a terahertz transmission line, and a circuit board. The radio frequency sending chip is packaged on the circuit board, and includes a radio frequency sending circuit, a feed transmission line, and a mode excitation structure. The mode conversion structure includes a metal inner wall, configured to couple a terahertz signal excited by the mode excitation structure into the terahertz transmission line. The terahertz transmission line is configured to transmit the terahertz signal. The receiving apparatus includes a similar part in a receiving direction. The subject matter herein implements efficient electromagnetic coupling and improves data transmission bandwidth.

Terahertz carrier sending apparatus and terahertz carrier receiving apparatus

This application provides a feed apparatus, a dual-band microwave antenna, and a dual-band antenna device. The feed apparatus includes a low-frequency feed and a high-frequency feed. The high-frequency feed is embedded into the low-frequency feed. The low-frequency feed includes a plurality of low-frequency array elements arranged in an array. The high-frequency feed includes a plurality of high-frequency array elements arranged in an array. At least one high-frequency array element is embedded into the low-frequency array element, and the low-frequency array element and each high-frequency array element embedded into the low-frequency array element have a common waveguide wall.

Growing community of inventors

Shenzhen, China

Luqi Zhang