United Microelectronics Corp.

Lung-En Kuo

Hsuan-Hsu Chen

Jiunn-Hsiung Liao

Shih-Chieh Hsu

Chia-Fu Hsu

Chun-Mao Chiou

Jian-Cun Ke

Po-Chao Tsao

Chen-Yi Weng

Chun-Lung Chen

Kun-Yuan Liao

Po-Wen Su

Chih-Tung Yeh

Ming-Te Wei

Ming-Hua Chang

Min-Chieh Yang

You-Di Jhang

Wen-Chen Wu

Chien-Ting Lin

Shih-Fang Tzou

Wei-Hao Huang

Ying-Chih Lin

Chia-Wei Hsu

Meng-Chun Lee

A fabricating method of a high electron mobility transistor includes providing a substrate. Then, a channel layer, an active layer, a P-type group III-V compound material layer, a metal compound material layer, a hard mask material layer and a patterned photoresist are formed to cover the substrate. Later, a dry etching process is performed to etch the hard mask material layer and the metal compound material layer to form a hard mask and a metal compound layer by taking the patterned photoresist as a mask. During the dry etching process, a spacer generated by by-products is formed to surround the patterned photoresist, the hard mask and the metal compound layer. After the dry etching process, the P-type group III-V compound material layer is etched by taking the spacer and the patterned photoresist as a mask.

High electron mobility transistor and fabricating method of the same

A method of cutting fins includes the following steps. A photomask including a snake-shape pattern is provided. A photoresist layer is formed over fins on a substrate. A photoresist pattern in the photoresist layer corresponding to the snake-shape pattern is formed by exposing and developing. The fins are cut by transferring the photoresist pattern and etching cut parts of the fins.

Method of cutting fin

A semiconductor device includes an interfacial layer on a substrate and agate structure on the interfacial layer. Preferably, the gate structure includes a patterned high-k dielectric layer, the patterned high-k dielectric layer comprises a metal oxide layer, and a horizontal direction width of the patterned high-k dielectric layer and a horizontal direction width of the interfacial layer are different. The semiconductor device also includes a first spacer adjacent to the gate structure and on part of the interfacial layer and contacting a top surface of the interfacial layer and a second spacer on the sidewalls of the first spacer and the interfacial layer. Preferably, a planar bottom surface of the second spacer is lower than a planar bottom surface of the first spacer and extending along a same direction as the planar bottom surface of the first spacer.

Semiconductor device and method for fabricating the same

A method for fabricating semiconductor device is disclosed. The method includes the steps of: providing a substrate; forming an interfacial layer on the substrate; forming a stack structure on the interfacial layer; patterning the stack structure to form a gate structure on the interfacial layer; forming a liner on the interfacial layer and the gate structure; and removing part of the liner and part of the interfacial layer for forming a spacer.

A sidewall image transfer (SIT) process is provided. First, a substrate is provided. A sacrificial layer having a pattern is formed on the substrate. A first measuring step is performed to measure a width of the pattern of the sacrificial layer. A material layer is formed conformally on the sacrificial layer, wherein a thickness of the material layer is adjusted according to the result of the first measuring step. Then, the material layer is removed anisotropically, so the material layer becomes a spacer on a sidewall of the sacrificial layer. Lastly, the sacrificial layer is removed.

Sidewall image transfer process

The present invention provides a semiconductor structure including a substrate, at least one fin group and a plurality of sub-fin structures disposed on the substrate, wherein the fin group is disposed between two sub-fin structures, and a top surface of each sub-fin structure is lower than a top surface of the fin group; and a shallow trench isolation (STI) disposed in the substrate, wherein the sub-fin structures are completely covered by the shallow trench isolation.

Manufacturing method for forming semiconductor structure with sub-fin structures

A semiconductor device is disclosed. The semiconductor device includes a substrate, a gate structure on the substrate, and a spacer adjacent to the gate structure, in which the bottom of the spacer includes a tapered profile and the tapered profile comprises a convex curve.

Semiconductor device having spacer with tapered profile

A method for fabricating semiconductor device is disclosed. The method includes the steps of: providing a substrate; forming a gate structure on the substrate; depositing a liner on the gate structure and the substrate; and performing an etching process by injecting a gas comprising CHF, O, and He for forming a spacer adjacent to the gate structure.

A method of forming a fin structure is provided. First, a substrate is provided, wherein a first region, a second region encompassing the first region, and a third region encompassing the second region are defined on the substrate. Then, a plurality of first trenches having a first depth are formed in the first region and the second region, wherein each two first trenches defines a first fin structure. The first fin structure in the second region is removed. Lastly, the first trenches are deepened to form a plurality of second trenches having a second depth, wherein each two second trenches define a second fin structure. The present invention further provides a structure of a non-planar transistor.

Non-planar transistor

A method for fabricating a metal-oxide semiconductor (MOS) transistor is disclosed. The method includes the steps of: providing a semiconductor substrate; forming a silicon layer on the semiconductor substrate; performing a first photo-etching process on the silicon layer for forming a gate pattern; forming an epitaxial layer in the semiconductor substrate adjacent to two sides of the gate pattern; and performing a second photo-etching process on the gate pattern to form a slot in the gate pattern while using the gate pattern to physically separate the gate pattern into two gates.

Method for fabricating metal-oxide semiconductor transistor

A semiconductor structure includes a substrate, a recess and a material. The recess is located in the substrate, wherein the recess has an upper part and a lower part. The minimum width of the upper part is larger than the maximum width of the lower part. The material is located in the recess.

Semiconductor structure and process thereof

Method of forming a FinFET structure

Metal-oxide semiconductor transistor

A semiconductor process includes the following steps. A fin-shaped structure is formed on a substrate. A gate structure and a cap layer are formed, wherein the gate structure is disposed across parts of the fin-shaped structure and parts of the substrate, the cap layer is on the gate structure, and the cap layer includes a first cap layer on the gate structure and a second cap layer on the first cap layer. A spacer material is formed to entirely cover the second cap layer, the fin-shaped structure and the substrate. The spacer material is etched, so that the sidewalls of the second cap layer are exposed and a spacer is formed beside the gate structure. The second cap layer is removed.

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Tainan, Taiwan

Lung-En Kuo