Winbond Electronics Corporation

Lun-Lun Chen

Hsiu-Han Liao

Yao-Ting Tsai

A semiconductor device having a conductive pad is provided, wherein the conductive pad includes a substrate, a dielectric layer, a plurality of vias, and a patterned conductive pad. The dielectric layer is overlying the substrate. The vias are disposed in the dielectric layer. The patterned conductive pad is disposed over the dielectric layer. The conductive pad includes, from a top view, at least three first conductive strips spaced apart from each other, arranged in different rows. The conductive strips in different rows are electrically and physically connected by a plurality of conductive strings. The conductive strings between different rows of the conductive strips are arranged in a staggered manner. The vias are disposed under the conductive strips.

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Taichung, Taiwan

Lun-Lun Chen