Apple Inc.

Lukose Ninan

Frank Faqiu Liang

Vinh H Diep

Po Weng Chiu

Brian L Chuang

Judith C Segura

Jonathan A Matheson

Kevin Z Lo

Leanne Bach Lien T Ly

Chong Li

Electronic devices have a PCB with a heat-generating component (e.g., POP or SOC), a heat sink, and an EMI shielding structure. A combination structure can include a top heat spreader/EMI shield located above and in thermal contact with the POP/SOC top, a bottom heat spreader/EMI shield located below and in thermal contact with the POP/SOC bottom, and a heat-directing component located on the PCB, laterally surrounding a majority of the POP/SOC sides, and between and in thermal contact with the top and bottom heat spreaders. Resulting heat paths for the POP/SOC include one through its top to the top heat spreader, another through its bottom to the bottom heat spreader, and others through its sides through the PCB through the heat-directing component to the top and bottom heat spreaders. The heat-directing component can be a metal horseshoe shaped pad integrally formed onto the PCB.

Combination parallel path heatsink and EMI shield

Growing community of inventors

Foster City, CA, United States of America

Lukose Ninan