Applied Materials, Inc.

Varian Semiconductor Equipment Associates, Inc.

Luke W Bonecutter

David T Blahnik

Jason M Schaller

Charles T Carlson

Paul Benjamin Reuter

Benjamin B Riordon

Karuppasamy Muthukamatchi

Jeff Hudgens

Douglas Brian Baumgarten

Rajkumar Thanu

Abhijit Ashok Kangude

William Tyler Weaver

Jay D Pinson, Ii

Robert Brent Vopat

Malcolm N Daniel, Jr

Rupankar Choudhury

Ramesh Bokka

Yunzhe Yang

Exemplary substrate processing systems may include a transfer region housing defining a transfer region fluidly coupled with a plurality of processing regions. A sidewall of the transfer region housing may define a sealable access for providing and receiving substrates. The systems may include a plurality of substrate supports disposed within the transfer region. The systems may also include a transfer apparatus having a central hub including a first shaft and a second shaft counter-rotatable with the first shaft. The transfer apparatus may include an eccentric hub extending at least partially through the central hub, and which is radially offset from a central axis of the central hub. The transfer apparatus may also include an end effector coupled with the eccentric hub. The end effector may include a plurality of arms having a number of arms equal to the number of substrate supports of the plurality of substrate supports.

Robot for simultaneous substrate transfer

Exemplary substrate processing systems may include a transfer region housing defining an internal volume. A sidewall of the transfer region housing may define a sealable access for providing and receiving substrates. The systems may include a plurality of substrate supports disposed within the transfer region. The systems may also include a transfer apparatus having a central hub including a first shaft and a second shaft concentric with and counter-rotatable to the first shaft. The transfer apparatus may include a first end effector coupled with the first shaft. The first end effector may include a plurality of first arms. The transfer apparatus may also include a second end effector coupled with the second shaft. The second end effector may include a plurality of second arms having a number of second arms equal to the number of first arms of the first end effector.

A load port system includes an isolation compartment coupled to an equipment front end module (EFEM). Reactive gas is to be removed from the isolation compartment. The load port system further includes an elevator disposed in the isolation compartment. The elevator is coupled to an elevator arm that extends from the isolation compartment into the EFEM through an opening to raise and lower a carrier opener within the EFEM.

Systems, apparatus, and methods for an improved load port

Exemplary substrate processing systems may include a transfer region housing defining a transfer region, and including substrate supports and a transfer apparatus. The transfer apparatus may include a central hub having a housing, and including a first shaft and a second shaft. The housing may be coupled with the second shaft, and may define an internal housing volume. The transfer apparatus may include a plurality of arms equal to a number of substrate supports of the plurality of substrate supports. Each arm of the plurality of arms may be coupled about an exterior of the housing. The transfer apparatus may include a plurality of arm hubs disposed within the internal housing volume. Each arm hub of the plurality of arm hubs may be coupled with an arm of the plurality of arms through the housing. The arm hubs may be coupled with the first shaft of the central hub.

Embodiments described herein relate to apparatus and techniques for mechanical isolation and thermal insulation in a process chamber. In one embodiment, an insulating layer is disposed between a dome assembly and a gas ring. The insulating layer is configured to maintain a temperature of the dome assembly and prevent thermal energy transfer from the dome assembly to the gas ring. The insulating layer provides mechanical isolation of the dome assembly from the gas ring. The insulating layer also provides thermal insulation between the dome assembly and the gas ring. The insulating layer may be fabricated from a polyimide containing material, which substantially reduces an occurrence of deformation of the insulating layer.

Dome stress isolating layer

Embodiments described herein provide a backside gas delivery assembly that prevents inert gas from forming parasitic plasma. The backside gas delivery assembly includes a first gas channel disposed in a stem of a substrate support assembly. The substrate support assembly includes a substrate support having a second gas channel extending from the first gas channel. The backside gas delivery assembly further includes a porous plug disposed within the first gas channel positioned at an interface of the stem and the substrate support, a gas source connected to the first gas channel configured to deliver an inert gas to a backside surface of a substrate disposed on an upper surface of the substrate support, and a gas tube in the first gas channel extending to the porous plug positioned at the interface of the stem and the substrate support.

Isolated backside helium delivery system

A carrier door opener includes one or more connector devices configured to interface with a door of a substrate carrier located at a load port. The carrier door opener further includes an outer surface forming a groove and a load port seal seated in the groove. The load port seal is configured to seal against a first portion of a planar surface of a panel of the load port around a panel opening formed by the panel. A second portion of the planar surface of the panel is configured to seal to a factory interface.

Electronic device manufacturing load port apparatus, systems, and methods

A plasma processing apparatus is provided including a radio frequency power source; a direct current power source; a chamber enclosing a process volume; and a substrate support assembly disposed in the process volume. The substrate support assembly includes a substrate support having a substrate supporting surface; an electrode disposed in the substrate support; and an interconnect assembly coupling the radio frequency power source and the direct current power source with the electrode.

Electrode assembly

A load port includes a panel including a back surface configured to face a front side of a housing of a factory interface. A groove formed in the back surface extends along an outer portion of the panel. The groove includes a flared base region and a neck region that extends to the flared base region. The load port further includes a seal seated in the groove. The seal is configured to engage the front side of the housing responsive to the panel being coupled to the front side of the housing.

Embodiments provide systems, apparatus, and methods for an improved load port that includes a frame supporting a dock and a carrier opener; an elevator operable to raise and lower the carrier opener; an isolation compartment within which the elevator is operable to move, the isolation compartment including a volume isolated from a volume of an equipment front end module (EFEM); and a purge supply within the isolation compartment operable to purge the isolation compartment of reactive gas trapped within the isolation compartment. Numerous additional aspects are disclosed.

An electronic device manufacturing system includes a factory interface that has a load port. The load port may include a panel having a back surface. The back surface may have a groove extending along an outer portion of the panel. The groove may include a neck region and a flared base region. The neck region may have a rectangular cross section that extends to a flared base region. A bulb seal or a rectangularly-shaped seal may be seated in the groove and may be configured to seal an interface between the load port and the factory interface. Methods of assembling a factory interface for an electronic device manufacturing system are also provided, as are other aspects.

An electronic device manufacturing system includes a factory interface that has a load port. The load port may include a panel having an opening therein and a carrier door opener that seals the opening when the door is closed. The carrier door opener may have a groove along an outer portion of the door. The groove may have a cross-sectional shape of a triangular prism frustum. A hollow O-ring may be seated in the groove and is configured to engage the panel when the carrier door opener is closed against the panel. Methods of assembling a factory interface for an electronic device manufacturing system are also provided, as are other aspects.

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Cedar Park, TX, United States of America

Luke W Bonecutter