Hamilton Sundstrand Corporation

Luke T Orsini

Jay W Kokas

Kevin P Roy

Richard A Poisson

Kenneth J Trotman

Jeffry K Kamenetz

Gregory DiVincenzo

Mark A Johnston

Edward John Marotta

Kerry R Querns

David Perley

William Betterini

Charles V DeSantis

Jay H Hartman

Matthew S Fitzpatrick

Steven R Fischer

Shun-Tien Lin

Robert C Hoeckele

Marc S McCloud

Gregory Divincenzo

A system comprises a package with top and bottom surfaces, a plurality of high-power transient voltage suppressors arranged within the package, and a robust lead frame. Each of the transient voltage suppressors has first and second major surfaces substantially perpendicular to the top and bottom surfaces of the package. The lead frame comprises leads connected to the major surfaces of the transient voltage suppressors. Each of the leads has a thickness greater than about 0.015 inches (or 0.381 mm) in a mounting portion, in order to dissipate heat from the transient voltage suppressors and to resist vibration-induced stress on the package.

Vertical mount transient voltage suppressor array

An electronic control configuration includes at least one secondary microprocessor operable to control a device. The at least one secondary microprocessor assumes protection control of the device responsive to a first type of failure by transmitting a protection control signal to a first effector. The at least one secondary microprocessor assumes backup control of the device responsive to a second type of failure by transmitting a backup control signal to a second effector. The backup control functionality of the at least one secondary microprocessor can be selectively disabled.

Architecture using integrated backup control and protection hardware

Growing community of inventors

Marlborough, CT, United States of America

Luke T Orsini