Infineon Technologies Ag

Lukas Ossowski

Joachim Mahler

Khalil Hosseini

Ivan Nikitin

Josef Schwaiger

Werner Kroninger

Ludwig Schneider

An integrated circuit is provided. The integrated circuit includes: a chip and encapsulation material covering at least three sides of the chip, the encapsulation material being formed from adhesive material. The integrated circuit includes a carrier adhered to the chip by means of the encapsulation material.

Integrated circuits and a method for manufacturing an integrated circuit

A semiconductor device having a topology adjustment and a method for adjusting the topology of a semiconductor device. The semiconductor device includes a semiconductor wafer having first and second opposing sides with an active area formed on a first portion of the first side having a topology extending a first distance above the first side. A support member is attached to a second portion of the first side and extending a second distance above the first side, wherein the first distance is about the same as the second distance. In some exemplary embodiments, the support member is formed by applying adhesive to the second portion. The wafer is then spun to adjust the second distance.

Semiconductor device and method

Growing community of inventors

Waldetzenberg, Germany

Lukas Ossowski