3d Glass Solutions, Inc.

Luis C Chenoweth

Jeff A Bullington

Jeb H Flemming

Roger Cook

Carrie F Schmidt

Mark Popovich

Sierra D Jarrett

A method of batch massively parallel die release of a die from a substrate enabling low cost mass production of with passive, system in package (SiP) or system-in-a-package, or systems-on-chip (SoC), filters and/or other devices from a glass substrate.

High efficiency die dicing and release

The present invention provides a method to fabricate an optical coupler comprising the steps of: preparing a photosensitive glass substrate comprising at least silica, lithium oxide, aluminum oxide, and cerium oxide; masking a halftone design with variation in optical density to delineate an optical element in the glass; exposing the photosensitive glass substrate to an activating energy source; exposing the photosensitive glass substrate to a heating phase of at least ten minutes above its glass transition temperature; cooling the photosensitive glass substrate to transform at least part of the exposed glass to a crystalline material to form a glass-crystalline substrate; and etching the glass-crystalline substrate with an etchant solution to form the one or more optical elements.

Methods of fabricating photosensitive substrates suitable for optical coupler

Growing community of inventors

Albuquerque, NM, United States of America

Luis C Chenoweth