Hewlett-packard Development Company, L.p.

Luis C Armendariz

Earl W Moore

Mark S Tracy

Steven S Homer

Jeffrey A Lev

Mark H Ruch

Dustin L Hoffman

David E Gough

Fangyong Dai

David A Pipho

Punan Tang

Adnan A Siddiquie

Joseph A Jones

Abdul Baten

Example implementations relate to recessed keycaps. In an example, a recessed keycap includes a keyboard frame including recesses that extend at least partially through respective internal faces of the keyboard frame and a keycap including protrusions, where each protrusion of the protrusions is disposed at least partially within and in contact with a respective recess of the recesses to movably couple the keycap to the keyboard frame.

Recessed keycaps

Example implementations relate to thermally fused spacers. In one example, keyboard membranes including thermally fused spacers include a first circuit including a first conductive trace and a first key contact of the keyboard membrane, where the first conductive trace is coupled to the first key contact, a second circuit including a second conductive trace and a second key contact of the keyboard membrane, where the second conductive trace is coupled to the second key contact, and wherein the second key contact is to couple to the first key contact, and a spacer formed of a layer of thermoplastic material, a first thermoplastic film, and a second thermoplastic film, where the spacer is fused via the first thermoplastic film to the first circuit and via the second thermoplastic film to the second circuit.

Thermally fused spacers

Example embodiments disclosed herein relate to a key including a primary dome, a plurality of second domes, and a first layer. The primary dome is to compress a switch if the primary dome collapses. The first layer is over the primary and secondary domes. The first layer collapses the primary dome and does not engage the secondary domes, if the first layer is pressed substantially levelly or parallel to the rest position.

Key including secondary domes

Interface systems and methods are provided. An interface system can include a first isolator () and a second isolator () coupled to a modular interface (). The interface can include a plurality of conductors (). The first isolator can be coupled to a first signal format compliant first input/output (I/O) device (). The second isolator can be coupled to a second signal format compliant second I/O device (). The first isolator can pass a first signal format compliant signal to, and suppress the reflection of at least a portion of a second signal format compliant signal from, the first I/O device. The second isolator can at least partially block a first signal format compliant signal from, and to pass a second signal format compliant signal to, the second I/O device.

Modular interface systems and methods

Heat dissipation apparatus for dissipating heat generated by a heat-generating component mounted to a circuit board. In one embodiment, the heat dissipation apparatus includes a thermally-conductive heat sink adapted to be placed in contact with the heat-generating component, a bracket adapted to hold the heat sink in place relative to the heat-generating component, and a single coil spring mounted to the bracket adapted to urge the heat sink into contact with the heat-generating component.

Apparatuses and methods for dissipating heat from a computer component

A vibration attenuation method comprising identifying a hard drive disposed on an electronic device and, based on the identity of the hard drive, attenuating an output of at least one operation of the electronic device.

Vibration identification and attenuation system and method

In one embodiment, an electrical connector adapted to receive a component module includes a body that defines a socket into which the module can be inserted, and an obstruction element adapted to physically interfere with the module when it is attempted to seat the module within the connector with the module only partially inserted into the socket.

Growing community of inventors

Spring, TX, United States of America

Luis C Armendariz