Rohm & Haas Electronic Materials LLC

Luis A Gomez

Michael K Gallagher

Joseph F Lachowski

Alejo M Lifschitz Arribio

Jonathan D Prange

Alexander Zielinski

Mark Lefebvre

Matthew A Thorseth

Mark Scalisi

Rebecca Lea Hazebrouck

Bryan Lieb

Mark A Scalisi

Crystal plane orientation enrichment compounds are applied to copper to modify copper grain orientation distribution to the favorable crystal plain orientation to enhance copper electroplating. Electroplating copper on the modified copper enables faster and selective electroplating.

Method of enhancing copper electroplating

Copper electroplating baths having a surface tension of &#x2266;40 mN/m are suitable for filling vias with copper, where such copper deposits are substantially void-free and substantially free of surface defects.

Plating method

Methods are provided for manufacturing optical display devices which remove an etch resist and residual post-etch metal in a single step. These methods are particularly useful in the manufacture of LCDs.

Stripping method

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Holden, MA, United States of America

Luis A Gomez