Sgs-thomson Microelectronics S.r.l.

Sgs-thomson Microelectronics S.p.a.

Luigi Sisti

Carlo Cini

Angelo Massironi

A process for manufacturing devices with improved connections between the pins and the semiconductor material chip which integrates electronic components. In order to allow the integration of signal components and power components in a same device with a reduced use of area for the soldering pads and with high reliability of the connections, the connecting wires are made of different materials. Advantageously, the wires for the power connections are based on aluminum and have large diameters, and the wires for the signal connections are gold-based and have a small diameter. In order to ensure good soldering, the ends of the pins on which the connecting wires are to be soldered are gold-plated.

Process for manufacturing integrated device with improved connections

An integrated device with improved connections between the pins and the semiconductor material chip which integrates electronic components. In order to allow the integration of signal components and power components in a same device with a reduced use of area for the soldering pads and with high reliability of the connections, the connecting wires are made of different materials. Advantageously, the wires for the power connections are based on aluminum and have large diameters, and the wires for the signal connections are gold-based and have a small diameter. In order to ensure good soldering, the ends of the pins on which the connecting wires are to be soldered are gold-plated.

Integrated device with improved connections between the pins and the

A multiple-chip semiconducting element in a case of metal and resin consists of a metallic plate, a body of synthetic resin which incorporates a portion of the plate, leaving free a larger surface thereof, and a large number of metallic terminals issuing from the same side of the resin body. Inside the resin body, a first semiconductor element chip is affixed to the metallic plate and a second semiconductor element chip is affixed to a metallic lamina made integral with at least one of the terminals and insulated electrically from the plate.

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Genoa, Italy

Luigi Sisti