Avanex Corporation

Lumentum Technology UK Limited

Corning Incorporated

Oclaro (north America Inc.)

Oclaro Inc.

Luigi Gobbi

Mario Bonazzoli

Roberto Galeotti

Marco Villa

Stefano Balsamo

Paolo Milanese

Simone M Pensa

Giovanni Gilardi

Marco Marazzi

Gloria Obetti

Federico Caccavale

An electro-optic modulator. The modulator is made as a plurality of discrete elements, and adjacent elements abut such that there are no free space optics between adjacent discrete elements. The modulator comprises a radio frequency, RF, element configured to modulate light passing through the element based on an electrical RF input. The plurality of discrete elements comprises a first set of discrete elements fabricated from thin film lithium niobate, TFLN, and a second set of discrete elements fabricated from silicon photonics, SiPh. The first set of discrete elements comprises the RF element.

Modulator assembly

An RF transition assembly () for enabling a radiofrequency transition between an RF transmission layer () of an electronic device and a conductor () which is electrically connected () to the RF transmission layer (). The conductor () extends generally orthogonal to the RF transmission layer (). The assembly comprises an open coaxial structure () located adjacent to an edge of the RF transmission layer (). The open coaxial structure () comprises a cavity () extending therethrough for receiving the conductor (). The cavity () comprises an opening facing the edge of the RF transmission layer () so as to direct electromagnetic radiation towards the RF transmission layer ().

RF transition assembly comprising an open coaxial structure with a cavity for receiving a conductor that is coupled orthogonal to an RF transmission layer

A package design for electro-optic devices has been developed in which the substrate supporting the electro-optic element serves also as the base of the device housing. The electro-optic element is flip-chip bonded to the substrate. In a preferred embodiment the substrate is a multi-level wiring board.

Electro-optic device packages

The present invention generally relates to an air cavity plastic package for a high frequency optical device. In one aspect, a module package for a high frequency optoelectronic device is provided. The module package includes an upper plastic housing having an upper cavity formed therein and a lower plastic housing having a lower cavity formed therein. The upper housing and the lower housing are configured to mate together such that the cavities form an enclosed air cavity between the housings. Additionally, upon creating a seal between the housings, an optical feed through is realized. The module package further includes a plurality of conductors disposed in the lower housing, each conductor having an upper end and a lower end, wherein the upper end is connectable to a chip disposed in the air cavity and the lower end is connectable to a board. In another aspect, a method of packaging and assembling a high frequency optical device is provided. In yet another aspect, a package assembly for an electro-optical modulator is provided.

Air cavity plastic package for high frequency optical devices

An electro-optical modulator is disclosed that has a microwave input, chip with a thin film resistor or a lumped resistor located between an input RF connector and an RF electrode on a Lithium Niobate chip. The accessory connection chip has a broadband attenuator like a thin film resistor which is placed in a microstrip line for effecting the electrical transmission to Lithium Niobate chip. The insertion of the thin film resistor before the RF electrode lowers the electrical return loss value as a function of frequency, allowing a lower driving voltage design or a reduced chip length without degrading the performances.

System for reducing the electrical return loss of a lithium niobate traveling wave optical modulator with low characteristic impedance

An integrated optical chip has a crystalline structure cut along parallel principal crystallographic planes and a thickness of less than 1.0 mm. An optical signal pathway is disposed generally longitudinally in one of the cut surfaces of the chip, and the chip is attached to a substrate material up to 1.0 mm thick and having similar coefficients of thermal expansion in that principal crystallographic plane. A grounding plane is disposed between the chip and substrate to provide an electrically conductive path between opposite lateral surfaces of the chip. A method of making the chip is also described.

Growing community of inventors

Milan, Italy

Luigi Gobbi