Rohm and Haas Company

Dow Global Technolgoies LLC

Dow Silicones Corporation

Ludwik S Cygan

Yinzhong Guo

James M Lipovsky

Carlos A Escobar Marin

Liang Chen

Joseph James Zupancic

Wenwen Li

Amit K Chaudhary

Douglas J Hasso

San Ardi Lee

Joseph Jacobs

Peter David Berezuk

Kelly Ann McManigal Gojkovich

Methods and apparatus for etching a high aspect ratio feature in a stack on a substrate are provided. The feature may be formed in the process of forming a 3D NAND device. Typically, the stack includes alternating layers of material such as silicon oxide and silicon nitride or silicon oxide and polysilicon. WFis provided in the etch chemistry, which substantially reduces or eliminates problematic sidewall notching. Advantageously, this improvement in sidewall notching does not introduce other tradeoffs such as increased bowing, decreased selectivity, increased capping, or decreased etch rate.

Waterborne dispersion composition

Methods for preparing waterborne heat seal coating compositions are disclosed, including (A) melt blending an ethylene vinyl acetate copolymer, a tackifier, and a wax in a first mixing apparatus to form a melt blend, (B) contacting the melt blend with an initial aqueous stream comprising a neutralizing agent, water, and a surfactant in an emulsification zone of the second mixing apparatus to form a dispersion, and (C) diluting the dispersion with water in a dilution zone of the second mixing apparatus to form the waterborne heat seal coating composition. Methods for preparing waterborne heat seal coating compositions are also disclosed, including (A) melt blending an ethylene vinyl acetate copolymer, a tackifier, and a wax in a mixing and conveying zone of a mixing apparatus to form a melt blend, (B) contacting the melt blend with an initial aqueous stream comprising a neutralizing agent, water, and a surfactant in an emulsification zone of the mixing apparatus to form a dispersion, and (C) diluting the dispersion with water in a dilution zone of the mixing apparatus to form the waterborne heat seal coating composition, wherein the length-to-diameter ratio of the extruder mixing apparatus is greater than or equal to 12 to 1. Waterborne heat seal coating compositions prepared according to the disclosed methods are also disclosed.

Methods for preparing waterborne heat seal coating compositions

Solvent-based adhesive compositions are disclosed herein. In some embodiments, the solvent-based adhesive compositions include (A) an isocyanate component comprising an isocyanate curing agent and (B) a hydroxyl component comprising a polyester polyol, a polyether polyol, and a phosphate ester compound. The isocyanate curing agent of the isocyanate component (A) crosslinks the components of the hydroxyl component. In some embodiments, the phosphate ester compound has the structure (I): (I) wherein R1 is any organic group. Methods for preparing solvent-based adhesive compositions are also disclosed. The methods include providing an isocyanate component (A) comprising an isocyanate curing agent, providing a hydroxyl component (B) comprising a polyol blend, comprising a polyester polyol and a polyether polyol, and a phosphate ester compound, curing the hydroxyl component (B) with the isocyanate component (A) at a mix ratio ((A):(B), by weight) of from 100:8 to 100:15, thereby forming the solvent-based adhesive composition. 

Solvent based adhesive compositions

A method is provided for bonding substrates using a prepolymer composition that is cured with electron beam radiation. The prepolymer composition provided for bonding the substrates contains at least one polyester resin and at least one polymerizable compound.

Method for preparing a bonded composite

Growing community of inventors

Downers Grove, IL, United States of America

Ludwik S Cygan