Infineon Technologies Ag

Ludwig Schneider

Josef Schwaiger

Ralf Otremba

Thorsten Meyer

Josef Hoeglauer

Helmut Strack

Xaver Schloegel

Markus Brunnbauer

Werner Kroeninger

Ottmar Geitner

Lukas Ossowski

Werner Kroninger

A semiconductor device having a topology adjustment and a method for adjusting the topology of a semiconductor device. The semiconductor device includes a semiconductor wafer having first and second opposing sides with an active area formed on a first portion of the first side having a topology extending a first distance above the first side. A support member is attached to a second portion of the first side and extending a second distance above the first side, wherein the first distance is about the same as the second distance. In some exemplary embodiments, the support member is formed by applying adhesive to the second portion. The wafer is then spun to adjust the second distance.

Semiconductor device and method

A semiconductor module. One embodiment provides at least two semiconductor chips placed on a carrier. The at least two semiconductor chips are then covered with a molding material to form a molded body. The molded body is thinned until the at least two semiconductor chips are exposed. Then, the carrier is removed from the at least two semiconductor chips. The at least two semiconductor chips are singulated.

Semiconductor module

Growing community of inventors

Parkstetten, Germany

Ludwig Schneider