Applied Materials, Inc.

Ludwig Ledl

Bernhard Gunter Mueller

Matthias Brunner

Yong Liu

Benjamin M Johnston

Ralf Schmid

Hung T Nguyen

Sriram Krishnaswami

Bernhard Schüler

Robert Trauner

Kulpreet Singh Virdi

Georg Jost

William Beaton

George Tzeng

A method of inspecting a sample with a charged particle beam device is described. The method comprises arranging the sample on a stage, determining a first focusing strength of an objective lens adapted to focus a charged particle beam on a first surface region of the sample that is arranged at a first distance from the objective lens in a direction of an optical axis, calculating a difference between the first distance and a predetermined working distance based on the determined first focusing strength, adjusting a distance between the first surface region and the objective lens by the calculated difference, and inspecting the first surface region. According to a further aspect, a charged particle beam device configured to be operated according to the above method is described.

Method of inspecting a sample with a charged particle beam device, and charged particle beam device

A charge control apparatus for controlling charge on a substrate in a vacuum chamber is described. The apparatus includes a light source emitting a beam of radiation having a divergence; a mirror configured to reflect the beam of radiation, wherein a curvature of a mirror surface of the curved mirror is configured to reduce the divergence of the beam of radiation; and a mirror support configured to rotatably support the curved mirror, wherein a rotation of the mirror varies the direction of the beam of radiation.

Apparatus configured for enhanced vacuum ultraviolet (VUV) spectral radiant flux and system having the apparatus

An apparatus and method for testing large area substrates is described. The large area substrates include patterns of displays and contact points electrically coupled to the displays on the large area substrate. The apparatus includes a prober assembly that is movable relative to the large area substrate and/or the contact points, and may be configured to test various patterns of displays and contact points on various large area substrates. The prober assembly is also configured to test fractional sections of the large area substrate positioned on a testing table, and the prober assembly may be configured for different display and contact point patterns without removing the prober assembly from the testing table.

Prober for electronic device testing on large area substrates

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Gröbenzell, Germany

Ludwig Ledl