Semikron Elektronik Gmbh &co.kg

Buhler Motor Gmbh

Semikron Elektronik Gmbh & Co. Kg Patentabteilung

Ludwig Hager

Ingo Bogen

Peter Beckedahl

Rainer Weiß

A transducer device for attachment to one end of a shaft of an electric drive, the shaft having a shaft axis. The transducer device includes at least one recess in the shaft end. Means are provided for engaging the transducer device with the at least one recess to create a form fitting connection acting in the direction of the shaft axis. Finally, a securing means is provided for preventing detachment of the form-fitting connection.

Transducer device with form-fitting connection

A power semiconductor device comprises a substrate; and power semiconductor components disposed on and connected thereto. The device includes a housing part with a housing wall having a first cutout. The device has, for making electrical contact therewith, a unitary load connection element which passes through the first cutout in an X direction, is electrically conductive, and has an outer connection section disposed outside the housing part and an inner connection section disposed within the housing part. A first bush which has an internal thread running in the X direction is rotationally fixed and movable in the X direction in the housing wall. The first outer connection section has a second cutout aligned with the first bush. The load connection element has a first holding element disposed near the first cutout, the holding element engaging in a groove in the housing wall which runs perpendicular to the X direction.

Power semiconductor arrangement

A power semiconductor module is presented. The power semiconductor module includes a plurality of capacitors coupled in parallel with each other. Each of the plurality of capacitors each includes a first and a second connection element. The power semiconductor module further includes a first and a second busbar. The first connection element of each of the plurality of capacitors is bonded to the first busbar, and the second connection element of each of the plurality of capacitors is bonded to the second busbar. The power semiconductor module further includes an insulating element disposed between the first busbar and the second busbar, and a pressure assembly that includes at least one pressure body and one associated counterpart pressure body. The first connection element and the second connection element of each of the plurality of capacitors is subjected to pressure and electrically bonded to the associated busbars by the pressure assembly.

Power semiconductor module with capacitors connected parallel to one another

Introduced is a power semiconductor module preferably a disk cell with a power semiconductor element arranged in the interior of the housing. In a preferred embodiment, the disk cell has two load and at least one auxiliary connection and the auxiliary connection extends from the power semiconductor element and ends at a corresponding exterior connection element. The exterior connection element of the auxiliary connection penetrates the housing and is a pen-type metal preform in the interior.

Growing community of inventors

Nürnberg, Germany

Ludwig Hager