Dow Global Technolgoies LLC

Blue Cube IP LLC

Owens-brockway Glass Container Inc.

Other

Ludovic Valette

Maurice J Marks

Hamed Lakrout

Brian John Chisholm

Susan L Smith

Olivier Dangmann

Cedric Charretton

Michael J Mullins

Angela I Padilla-Acevedo

Mark B Wilson

Kandathil Eapen Verghese

Yong-jiang Li

Eva Mifsud

Ha Q Pham

Gyongyi Gulyas

Bernd Hoevel

Rajesh H Turakhia

Patricia L Roberts

Nikhil Eapen Verghese

Stephanie K Anderson

James Wells Carter

Bill Z Dellinger

Martine Rousse

Itaru Kudose

Terri J Carson

Hynek Benes

Leiming Ji

Wenji K Zhao

Cui-ping Chen

Eva Misfud

This disclosure describes substrate(s) having a three-dimensional (3D) feature formed thereon and methods of forming the features. One method involves applying a first layer of UV-curable material on a surface of the glass container around a circumference of the container and curing the first layer of UV-curable material to produce a first cured material layer that forms at least a portion of a first 3D feature. The method further comprises applying a second layer of UV-curable material on the surface of the glass container, spaced apart from the first 3D feature, around the circumference of the container, and curing the second layer of UV-curable material to produce a second cured material layer that forms at least a portion of a second 3D feature. The portion of the glass container between the first and second 3D features has a circumference less than that of the first or second 3D features.

Three-dimensional printing on glass containers

This disclosure describes substrate(s) formed with a three-dimensional (3D) feature thereon, and method(s) of printing the same. One method includes identifying a plurality of locations on a substrate surface where the three-dimensional feature will be formed, determining a height value of the three-dimensional feature at each location, assigning a grayscale value to each location based on the height value, and applying ink to the substrate surface at each location according to the assigned grayscale value.

A liquid epoxy resin composition having a reduced tendency to crystallize including at least one liquid epoxy resin having the following generic chemical Structure (I): where n is 0 or an integer of 1 or more; and wherein n=0 is in the range of between about 1 wt % and about 90 wt %; wherein; n=1 is in the range of between about 7 wt % and about 20 wt %; n=2 is in the range of between about 0.8 wt % and about 3 wt %; and n=3 and above is in the range of about 0 wt % and about 2 wt %. 

Liquid epoxy resin formulations

A curable divinylarene dioxide resin composition including (a) at least one divinylarene dioxide, (b) at least one cationic photoinitiator, and (c) optionally, at least one pigment material; a process for making the curable divinylarene dioxide resin composition; and a cured divinylarene dioxide resin composition made therefrom. The cured product made from the above curable divinylarene dioxide resin composition offers improved properties and are useful for various applications including ink formulations.

Divinylarene dioxide resin compositions

A process for preparing a conductive carbonized layered article including the steps of: (I) providing a liquid carbon precursor formulation comprising (a) at least one aromatic epoxy resin; and (b)(i) at least one aromatic co-reactive curing agent, (b) (ii) at least one catalytic curing agent, or (b)(iii) a mixture thereof; wherein the liquid precursor composition has a neat viscosity of less than 10,000 mPa-s at 25&#xb0; C. prior to adding optional components, prior to curing, and prior to carbonizing; and wherein the liquid precursor composition being cured has a carbon yield of at least 35 weight percent disregarding the weight of the substrate and any optional components present in the composition; (II) applying the liquid formulation of step (I) as a thin coating layer onto at least a portion of the surface of a substrate; (III) curing the liquid formulation of step (II) to form a cured product, wherein the cured product has a carbon yield of at least 35 weight percent disregarding the weight of the substrate and any optional components present in the composition; and (IV) carbonizing the cured product of step (III) to form a conductive carbonized layered article; and a conductive carbonized layered article such as a carbon optical transparent electrode (COTE) prepared by the above process.

Conductive carbonized layered article

A process for preparing a carbon-carbon composite including the steps of: (a) providing a curable low viscosity aromatic epoxy resin liquid formulation, wherein the formulation has a neat viscosity of less than 10,000 mPa-s at 25&#xb0; C. prior to adding optional components, prior to curing, and prior to carbonizing; and wherein the formulation being cured has a carbon yield of at least 35 wt % disregarding the weight of the carbon matrix and any optional components present in the composition; (b) contacting a carbon matrix with the formulation of step (a); (c) curing the contacted carbon matrix of step (b); and (d) carbonizing the cured carbon matrix of step (c) to form a carbon-carbon composite; and a carbon-carbon composite made by the process.

Carbon&#x2014;carbon composites

A process for preparing a vitreous carbon including the steps of: (I) providing a curable low viscosity liquid carbon precursor formulation comprising (a) at least one aromatic epoxy resin; and (b)(i) at least one aromatic co-reactive curing agent, (b) (ii) at least one catalytic curing agent, or (b)(iii) a mixture thereof; wherein the liquid precursor composition has a neat viscosity of less than 10,000 mPa&#xb7;s at 25&#xb0; C. prior to adding optional components, prior to curing, and prior to carbonizing; and wherein the liquid precursor composition being cured has a carbon yield of at least 35 weight percent as measured in the absence of optional components; (II) curing the liquid formulation from step (I) to form a cured product wherein the cured product has a carbon yield of at least 35 weight percent as measured in the absence of optional components; (III) carbonizing the cured product from step (II) to form a carbonized composition; and (IV) purifying the carbonized product from step (III) to form a vitreous carbon composition; and a vitreous carbon prepared by the above process.

Vitreous carbon composition

A solvent-free curable epoxy resin composition including (a) at least one divinylarene dioxide; and (b) at least one hardener; wherein the solvent-free curable epoxy resin composition is substantially free of solvent and has at least two exotherm peaks and wherein the exothermic peak difference of the two exotherm peaks is sufficient to allow the curable solvent-free epoxy resin composition of being B-staged.

Curable resin compositions

A curable epoxy resin composition including (a) at least one epoxy resin; and (b) at least one hardener; wherein the curable epoxy resin composition has at least two exotherm peaks representing at least two distinct chemical reactions and wherein the exothermic peak difference of the two exotherm peaks is sufficient to allow the curable epoxy resin composition of being B-staged.

Thermosettable compositions are described having improved adhesion to metal substrates when cured comprising (a) at least one curable epoxy resin; (b) at least one hardener, each hardener having less than 1 primary amine group per molecule and not more than 1 secondary amine group per molecule, the hardener(s) comprising at least one polyhydroxy hydrocarbon, hydrocarbon capable of generating multiple hydroxy groups per molecule during curing of the thermosettable material, or poly(acid anhydride)hydrocarbon other than a blend of (1) a copolymer of an ethylenically unsaturated anhydride and a vinyl compound and (2) a copolymer of an ethylenically unsaturated anhydride and an elastomer, and (c) at least one triblock copolymer comprising at least one elastomeric block and at least one acrylic block. Processes for making a coated article, a fiber-reinforced composite article, prepregs and laminates using the thermosettable compositions are also described, which are useful for making coated articles, fiber-reinforced composites, prepregs, laminates and printed wiring boards.

Curable epoxy resin compositions having improved adhesion to metal substrates and processes for making and using the same

Storage-stable reactive inorganic clusters and a process for preparing such storage-stable reactive inorganic clusters (e.g., silica structures) having, for example, reactive amino groups. The storage-stable reactive inorganic clusters may be used as a curing agent for thermosetting resin compositions such as epoxy resins.

Reactive inorganic clusters

A thermosettable composition including (a) at least an amphophilic block copolymer, (b) at least a polyol, (c) at least an epoxy resin containing an average at least 2 oxirane rings per molecule, (d) at least an anhydride hardener containing an average at least 1 anhydride ring per molecule, and (e) at least a catalyst; and a thermoset product prepared from said thermosettable composition.

Thermosettable composition containing a combination of an amphiphilic block copolymer and a polyol and a thermoset product therefrom

A half ester of an organic polyol made by reacting polyols with anhydrides; a thermosettable composition including (i) the half ester of an organic polyol, (ii) an anhydride, (iii) an epoxide, and (iv) a catalyst; and a thermoset product made from such thermosettable composition. The thermosettable compositions of the present invention are useful in various applications such as casting, potting, and encapsulation, such as electrical and electronics applications, and composites. The thermoset products made from the thermosettable compositions of the present invention have improved mechanical performances, especially toughness and mechanical strength, while maintaining high thermal resistance.

Thermosettable composition containing a half ester of a cycloaliphatic diol and a thermoset product therefrom

A thermosettable composition including: (a) at least one thermosetting resin; (b) at least one curing agent for the at least one thermosetting resin; (c) at least one high aspect ratio filler; wherein the aspect ratio of the filler is higher than 5:1; and (d) optionally, at least one catalyst for polymerization, including homopolymerization, of the at least one thermosetting resin; or optionally, at least one catalyst for a reaction between the at least one thermosetting resin and the at least one curing agent.

Growing community of inventors

Lake Jackson, TX, United States of America

Ludovic Valette