Applied Materials, Inc.

Varian Semiconductor Equipment Associates, Inc.

Applied Mateirals, Inc.

Ludovic Godet

Rutger Meyer Timmerman Thijssen

Jinxin Fu

Srinivas D Nemani

Joseph C Olson

Yongan Xu

Timothy J Miller

Ellie Y Yieh

Vikram Singh

Wayne McMillan

Anthony Renau

Christopher R Hatem

Qiwei Liang

Sang Ki Nam

Erica Chen

Kazuya Daito

Robert Jan Visser

Svetlana Radovanov

Morgan Evans

George D Papasouliotis

Deepak Arabagatte Ramappa

Tristan Yonghui Ma

Tobin Kaufman-Osborn

Daihua Zhang

Christopher Dennis Bencher

Paul F Ma

Visweswaren Sivaramakrishnan

Benjamin B Riordon

James D Strassner

John J Hautala

Douglas A Buchberger, Jr

Bon-Woong Koo

Bencherki Mebarki

Abhijit Basu Mallick

Frank Sinclair

Kyle Moran Hanson

Mehul B Naik

Daniel J Woodruff

Pramit Manna

Mingwei Zhu

Costel Biloiu

Andre P Labonte

Randy Harris

Kaushal Kishore Singh

Yingdong Luo

Annamalai Lakshmanan

Matthew D Scotney-Castle

Kartik Ramaswamy

Yang Yang

Srinivas Gandikota

Nag B Patibandla

Rui Cheng

Yong Cao

Chentsau Chris Ying

Zhebo Chen

Huixiong Dai

Ziqing Duan

Christopher S Ngai

Manivannan Thothadri

Adib M Khan

Martin A Hilkene

Daniel Lee Diehl

Nitin K Ingle

Er-Xuan Ping

Peter F Kurunczi

Russell J Low

Atul Gupta

Kevin M Daniels

Lei Zhou

Liqi Wu

Ying Di Zhang

Sivapackia Ganapathiappan

Hua Chung

Anchuan Wang

Michael Wayne Stowell, Jr

Wei-Sheng Lei

Joseph Yudovsky

Anantha K Subramani

Samarth Bhargava

Yixiong Yang

Yue Chen

Mukund Srinivasan

Paul J Murphy

Fei C Wang

Prerna Sonthalia Goradia

Kamal Hadidi

Connie P Wang

Kurtis Leschkies

Xin Liu

Kevin Messer

Douglas Buchberger

Wei V Tang

Zihui Li

Jonathan Gerald England

Jay Thomas Scheuer

Umesh M Kelkar

Prashanth Kothnur

Christopher W Campbell

Ching-Mei Hsu

David Masayuki Ishikawa

Embodiments described herein provide for a measurement system having an aperture filtering component and methods of utilizing the measurement system. The measurement system described herein includes a measurement arm and a stage. The measurement arm projects a light beam to a top surface of an optical device structure. Multi-reflection beams resulting from reflections and diffraction off other surfaces of a non-opaque substrate leads to interference. The measurement arm includes an aperture (e.g., an aperture filtering component) that filters the multi-reflection beams from being relayed to the detector. As such, only images of the light beam are relayed to the detector.

Methods for high-resolution, stable measurement of pitch and orientation in optical gratings

Embodiments of the present disclosure relate to methods, systems, and apparatus for inkjet printing self-assembled monolayer (SAM) structures on substrates. In one embodiment, which can be combined with other embodiments, one or more SAM layers are printed on a substrate surface of a substrate in a localized manner such that a portion of the substrate surface is left exposed to a processing region of the inkjet chamber. The printing includes spraying one or more subsections of the substrate surface with an ink, the ink having a SAM composition. The SAM composition includes an active component, and a hydrophobic tail.

Methods, systems, and apparatus for inkjet printing self-assembled monoloayer (SAM) structures on substrates

Embodiments described herein provide for optical devices with methods of forming optical device substrates having at least one area of increased refractive index or scratch resistance. One method includes disposing an etch material on a discrete area of an optical device substrate or an optical device layer, disposing a diffusion material in the discrete area, and removing excess diffusion material to form an optical material in the optical device substrate or the optical device layer having a refractive index greater than or equal to 2.0 or a hardness greater than or equal to 5.5 Mohs.

Ion implantation to modify glass locally for optical devices

Embodiments of the present disclosure relate to measurement systems and methods of measuring efficiency of optical devices. In one example, the measurement systems include a light source, a mirror, an illumination source, and a sensor. The light source provides a light beam to the optical device to be diffracted into diffraction beams having diffraction orders. The diffractions beams form a diffraction pattern. The method includes positioning the optical device in the measurement system and directing the diffraction beams to the sensor. The sensor is operable to measure the efficiency of the optical device by measuring the diffraction pattern.

Method of measuring efficiency for optical devices

Embodiments described herein include a waveguide combiner having an edge coated with an optically absorbent composition and a method of coating the edge of the waveguide combiner with the optically absorbent composition. The optically absorbent composition includes one or more types of nanoparticles or microparticles, at least one of one or more dyes or one or more pigments, and a polymer matrix of one or more binders. The method includes producing an optically absorbent formulation. The optically absorbent formulation includes one or more types of particles, at least one of one or more dyes or one or more pigments, one or more binders, and one or more solvents. The optically absorbent formulation is applied on an edge of a waveguide combiner using an edge blackening tool. The formulation is cured with radiation to form the optically absorbent composition.

High index edge blackening material

Embodiments of the present disclosure generally relate to methods for forming features having small and large line widths on the same substrate or device. In some embodiments, the methods described and discussed herein can be used to produce optical and photonic devices. These devices, including augmented reality (AR) devices and/or virtual reality (VR) devices, have desired pattern areas with different features and/or line widths to achieve the desired optical performance.

Methods for preparing small features on a substrate

Embodiments of the present disclosure generally relate to methods for forming a waveguide. Methods may include measuring a waveguide substrate, the waveguide having a substrate thickness distribution; and depositing an index-matched layer onto a surface of the waveguide, the index-matched layer having a first surface disposed on the waveguide substrate and a second surface opposing the first surface, wherein the index-matched layer is disposed only over a portion of the waveguide substrate, and a device slope of a second surface of the index-matched layer is substantially the same as the waveguide slope of the first surface of the waveguide.

Total or local thickness variation for optical devices

A method of processing an optical device is provided, including: positioning an optical device on a substrate support in an interior volume of a process chamber, the optical device including an optical device substrate and a plurality of optical device structures formed over the optical device substrate, each optical device structure including a bulk region formed of silicon carbide and one or more surface regions formed of silicon oxycarbide. The method further includes providing one or more process gases to the interior volume of the process chamber, and generating a plasma of the one or more process gases in the interior volume for a first time period when the optical device is on the substrate support, and stopping the plasma after the first time period. A carbon content of the one or more surface regions of each optical device structure is reduced by at least 50% by the plasma.

Optical device improvement

Embodiments of the present disclosure relate to optical devices for augmented, virtual, and/or mixed reality applications. In one or more embodiments, an optical device metrology system is configured to measure a plurality of first metrics and one or more second metrics for optical devices, the one or more second metrics including a display leakage metric.

In-line metrology systems, apparatus, and methods for optical devices

Embodiments of the present disclosure relate to bake apparatuses for handling and uniform baking of substrates and methods for the handling and the uniform baking of substrates. The bake apparatuses allow the substrates to be heated to a temperature greater than 50° C. without bowing of about 1 mm to about 2 mm from the edge of the substrates to the center of the substrates. The bake apparatuses heat the substrates uniformly or substantially uniformly to improve substrate quality.

Bake devices for handling and uniform baking of substrates

Embodiments described herein relate to flat optical devices and methods of forming flat optical devices. One embodiment includes a substrate having a first arrangement of a first plurality of pillars formed thereon. The first arrangement of the first plurality of pillars includes pillars having a height h and a lateral distance d, and a gap g corresponding to a distance between adjacent pillars of the first plurality of pillars. An aspect ratio of the gap g to the height h is between about 1:1 and about 1:20. A first encapsulation layer is disposed over the first arrangement of the first plurality of pillars. The first encapsulation layer has a refractive index of about 1.0 to about 1.5. The first encapsulation layer, the substrate, and each of the pillars of the first arrangement define a first space therebetween. The first space has a refractive index of about 1.0 to about 1.5.

Air-spaced encapsulated dielectric nanopillars for flat optical devices

Embodiments of the present disclosure generally relate to optical devices. More specifically, embodiments described herein relate to optical devices and methods of manufacturing a patterned optical device film on an optical device substrate. According to certain embodiments, an inkjet deposition process is used to deposit a patterned inkjet coating layer on the optical device substrate. A deposition process may then be used to deposit an optical device material on the patterned inkjet coating and the optical device substrate. The patterned inkjet coating on the optical device substrate may then be washed with an appropriate detergent to lift-off the patterned inkjet coating layer from the optical device substrate to form the patterned optical device film.

Patterning of optical device films via inkjet soluble mask, deposition, and lift-off

Embodiments described herein provide for devices and methods of measuring a pitch P of optical device structures and an orientation angle ϕ of the optical device structures. One embodiment of the system includes an optical arm coupled to an arm actuator. The optical arm includes a light source. The light source emits a light path operable to be diffracted to the stage. The optical arm further includes a first beam splitter and a second beam splitter positioned in the light path. The first beam splitter directs the light path through a first lens and the second beam splitter directs the light path through a first dove prism and a second lens. The optical arm further includes a first detector operable to detect the light path from the first lens and second detector operable to detect the light path from the second lens.

Interference in-sensitive Littrow system for optical device structure measurement

Embodiments herein provide for a method of determining an optical device modulation transfer function (MTF). The method described herein includes projecting a baseline image of a pattern from a light engine to a detector. The baseline image is analyzed to determine a baseline function. A baseline fast Fourier transform (FFT) or a baseline MTF of the baseline function is obtained. The method further includes projecting an image of the pattern from the light engine to one or more optical devices. The pattern is outcoupled from the one or more optical devices to the detector. The image is analyzed to determine a function. A function FFT or a function MTF is obtained corresponding to the image. An optical device MTF of the one or more optical devices is determined by comparing the baseline FFT and the function FFT determined by analyzing the image or by comparing the baseline MTF and the function MTF determined by analyzing the image.

Optical resolution measurement method for optical devices

Growing community of inventors

Sunnyvale, CA, United States of America

Ludovic Godet