Applied Materials, Inc.

Varian Semiconductor Equipment Associates, Inc.

Ludovic Godet

Rutger Meyer Timmerman Thijssen

Srinivas D Nemani

Joseph C Olson

Timothy J Miller

Ellie Y Yieh

Rami Hourani

Anthony Renau

Qiwei Liang

Robert Jan Visser

Svetlana Radovanov

Morgan Evans

George D Papasouliotis

Christopher Dennis Bencher

Paul F Ma

Visweswaren Sivaramakrishnan

Benjamin B Riordon

John J Hautala

Douglas A Buchberger, Jr

Bon-Woong Koo

Abhijit Basu Mallick

Frank Sinclair

Kyle Moran Hanson

Mehul B Naik

Pramit Manna

Daniel J Woodruff

Mingwei Zhu

Costel Biloiu

Kartik Ramaswamy

Yang Yang

Srinivas Gandikota

Nag B Patibandla

Rui Cheng

Yong Cao

Zhebo Chen

Chentsau Chris Ying

Nitin K Ingle

Er-Xuan Ping

Samarth Bhargava

Peter F Kurunczi

Ying Di Zhang

Sivapackia Ganapathiappan

Anchuan Wang

Hua Chung

Michael Wayne Stowell, Jr

Wei-Sheng Lei

Joseph Yudovsky

Siddarth A Krishnan

Jinxin Fu

Vikram Singh

Wayne McMillan

Christopher R Hatem

Sang Ki Nam

Kazuya Daito

Deepak Arabagatte Ramappa

Daihua Zhang

Tristan Yonghui Ma

Tobin Kaufman-Osborn

James D Strassner

Bencherki Mebarki

Yingdong Luo

Andre P Labonte

Randy Harris

Kaushal Kishore Singh

Annamalai Lakshmanan

Matthew D Scotney-Castle

Huixiong Dai

Ziqing Duan

Christopher S Ngai

Manivannan Thothadri

Martin A Hilkene

Adib M Khan

Daniel Lee Diehl

Russell J Low

Kevin Messer

Atul Gupta

Kevin M Daniels

Lei Zhou

Liqi Wu

Anantha K Subramani

Yixiong Yang

Yue Chen

Mukund Srinivasan

Paul J Murphy

Prerna Sonthalia Goradia

Fei C Wang

Kamal Hadidi

Connie P Wang

Kurtis Leschkies

Xin Liu

Douglas Buchberger

Wei V Tang

Zihui Li

Prashanth Kothnur

Umesh M Kelkar

Jay Thomas Scheuer

Jonathan Gerald England

David Masayuki Ishikawa

Christopher W Campbell

Ching-Mei Hsu

A method and apparatus for creating a flat optical structure is disclosed. The method includes etching at least one trench in a substrate, placing a dielectric material in at least one trench in the substrate and encapsulating the top of the substrate with a film.

Dielectric filled nanostructured silica substrate for flat optical devices

Embodiments of the present disclosure generally relate to methods for forming a waveguide. Methods may include measuring a waveguide substrate, the waveguide having a substrate thickness distribution; and depositing an index-matched layer onto a surface of the waveguide, the index-matched layer having a first surface disposed on the waveguide substrate and a second surface opposing the first surface, wherein the index-matched layer is disposed only over a portion of the waveguide substrate, and a device slope of a second surface of the index-matched layer is substantially the same as the waveguide slope of the first surface of the waveguide.

Total or local thickness variation for optical devices

Embodiments of the present disclosure generally relate to encapsulated optical devices and methods of forming encapsulated optical devices. The optical devices include a plurality of optical device structures disposed on a substrate. An encapsulation coating is disposed over the plurality of optical device structures. The encapsulation coating includes a ratio of encapsulation material to solvent. A plurality of gaps are formed in the optical device. The plurality of gaps are formed when the solvent is evaporated from the encapsulation coating. The material composition of the encapsulation coating, the width and device angle of the plurality of optical device structures, as well as process parameters of the spin on coating process, the curing process, the baking process, the drying process, and the developing process will affect the formation of the plurality of gaps and the depth at which the plurality of gaps are formed.

Airgap structures for improved eyepiece efficiency

Embodiments of the present disclosure generally relate to processing an optical workpiece containing grating structures on a substrate by deposition processes, such as atomic layer deposition (ALD). In one or more embodiments, a method for processing an optical workpiece includes positioning a substrate containing a first layer within a processing chamber, where the first layer contains grating structures separated by trenches formed in the first layer, and each of the grating structures has an initial critical dimension, and depositing a second layer on at least the sidewalls of the grating structures by ALD to produce corrected grating structures separated by the trenches, where each of the corrected grating structures has a corrected critical dimension greater than the initial critical dimension.

Atomic layer deposition on optical structures

Embodiments described herein provide for a measurement system having an aperture filtering component and methods of utilizing the measurement system. The measurement system described herein includes a measurement arm and a stage. The measurement arm projects a light beam to a top surface of an optical device structure. Multi-reflection beams resulting from reflections and diffraction off other surfaces of a non-opaque substrate leads to interference. The measurement arm includes an aperture (e.g., an aperture filtering component) that filters the multi-reflection beams from being relayed to the detector. As such, only images of the light beam are relayed to the detector.

Methods for high-resolution, stable measurement of pitch and orientation in optical gratings

Embodiments of the present disclosure relate to methods, systems, and apparatus for inkjet printing self-assembled monolayer (SAM) structures on substrates. In one embodiment, which can be combined with other embodiments, one or more SAM layers are printed on a substrate surface of a substrate in a localized manner such that a portion of the substrate surface is left exposed to a processing region of the inkjet chamber. The printing includes spraying one or more subsections of the substrate surface with an ink, the ink having a SAM composition. The SAM composition includes an active component, and a hydrophobic tail.

Methods, systems, and apparatus for inkjet printing self-assembled monoloayer (SAM) structures on substrates

Embodiments described herein provide for optical devices with methods of forming optical device substrates having at least one area of increased refractive index or scratch resistance. One method includes disposing an etch material on a discrete area of an optical device substrate or an optical device layer, disposing a diffusion material in the discrete area, and removing excess diffusion material to form an optical material in the optical device substrate or the optical device layer having a refractive index greater than or equal to 2.0 or a hardness greater than or equal to 5.5 Mohs.

Ion implantation to modify glass locally for optical devices

Embodiments of the present disclosure relate to measurement systems and methods of measuring efficiency of optical devices. In one example, the measurement systems include a light source, a mirror, an illumination source, and a sensor. The light source provides a light beam to the optical device to be diffracted into diffraction beams having diffraction orders. The diffractions beams form a diffraction pattern. The method includes positioning the optical device in the measurement system and directing the diffraction beams to the sensor. The sensor is operable to measure the efficiency of the optical device by measuring the diffraction pattern.

Method of measuring efficiency for optical devices

Embodiments described herein include a waveguide combiner having an edge coated with an optically absorbent composition and a method of coating the edge of the waveguide combiner with the optically absorbent composition. The optically absorbent composition includes one or more types of nanoparticles or microparticles, at least one of one or more dyes or one or more pigments, and a polymer matrix of one or more binders. The method includes producing an optically absorbent formulation. The optically absorbent formulation includes one or more types of particles, at least one of one or more dyes or one or more pigments, one or more binders, and one or more solvents. The optically absorbent formulation is applied on an edge of a waveguide combiner using an edge blackening tool. The formulation is cured with radiation to form the optically absorbent composition.

High index edge blackening material

Embodiments of the present disclosure generally relate to methods for forming features having small and large line widths on the same substrate or device. In some embodiments, the methods described and discussed herein can be used to produce optical and photonic devices. These devices, including augmented reality (AR) devices and/or virtual reality (VR) devices, have desired pattern areas with different features and/or line widths to achieve the desired optical performance.

Methods for preparing small features on a substrate

A method of processing an optical device is provided, including: positioning an optical device on a substrate support in an interior volume of a process chamber, the optical device including an optical device substrate and a plurality of optical device structures formed over the optical device substrate, each optical device structure including a bulk region formed of silicon carbide and one or more surface regions formed of silicon oxycarbide. The method further includes providing one or more process gases to the interior volume of the process chamber, and generating a plasma of the one or more process gases in the interior volume for a first time period when the optical device is on the substrate support, and stopping the plasma after the first time period. A carbon content of the one or more surface regions of each optical device structure is reduced by at least 50% by the plasma.

Optical device improvement

Embodiments of the present disclosure relate to optical devices for augmented, virtual, and/or mixed reality applications. In one or more embodiments, an optical device metrology system is configured to measure a plurality of first metrics and one or more second metrics for optical devices, the one or more second metrics including a display leakage metric.

In-line metrology systems, apparatus, and methods for optical devices

Embodiments of the present disclosure relate to bake apparatuses for handling and uniform baking of substrates and methods for the handling and the uniform baking of substrates. The bake apparatuses allow the substrates to be heated to a temperature greater than 50° C. without bowing of about 1 mm to about 2 mm from the edge of the substrates to the center of the substrates. The bake apparatuses heat the substrates uniformly or substantially uniformly to improve substrate quality.

Bake devices for handling and uniform baking of substrates

Growing community of inventors

Sunnyvale, CA, United States of America

Ludovic Godet