Soitec

S.o.i.tec Silicon on Insulator Technologies

S.o.i. Tec Silicon on Insulator Technologies, S.a.

Commissariat a L'energie Atomique Et Aux Energies Alternatives

Ludovic Ecarnot

Walter Schwarzenbach

Oleg Kononchuk

Eric Neyret

Bich-Yen Nguyen

Christophe Maleville

Nadia Ben Mohamed

Nicolas Daval

Patrick Reynaud

Christelle Michau

Mariam G Sadaka

Didier Landru

Frank Fournel

Ionut Radu

Sébastien Kerdiles

Marcel Broekaart

Daniel Delprat

Christophe Figuet

Emmanuel Arene

Carole David

François Rieutord

Carine Duret

Francois Boedt

Damien Massy

Khalid Radouane

Damien Parissi

Willy Michel

Cédric Malaquin

Guillaume Besnard

Séverin Rouchier

Christophe Malville

François Boedt

Oleg Kononchuck

Isabelle Guerin

Nadia Ben Mohammed

Manuel Sellier

Christophe Girard

Jean-Michel Hartmann

Bruno Clemenceau

Aymen Ghorbel

Stéphane Thieffry

A process for hydrophilic bonding first and second substrates, comprising: —bringing the first and second substrates into contact to form a bonding interface between main surfaces of the first and second substrates, and—applying a heat treatment to close the bonding interface. The process further comprises, before the step of bringing into contact, depositing, on the main surface of the first and/or second substrate, a bonding layer comprising a non-metallic material that is permeable to dihydrogen and that has, at the temperature of the heat treatment, a yield strength lower than that of at least one of the materials of the first substrate and of the second substrate located at the bonding interface. The layer has a thickness between 1 and 6 nm, and the heat treatment is carried out at a temperature lower than or equal to 900° C., and preferably lower than or equal to 600° C.

Process for hydrophilically bonding substrates

Methods of forming semiconductor structures comprising one or more cavities, which may be used in the formation of microelectromechanical system (MEMS) transducers, involve forming one or more cavities in a first substrate, providing a sacrificial material within the one or more cavities, bonding a second substrate over a surface of the first substrate, forming one or more apertures through a portion of the first substrate to the sacrificial material, and removing the sacrificial material from within the one or more cavities. Structures and devices are fabricated using such methods.

Methods of fabricating semiconductor structures including cavities filled with a sacrificial material

A semiconductor on insulator type structure, which may be used for a front side type imager, successively comprises, from its rear side to its front side, a semiconductor support substrate, an electrically insulating layer and an active layer comprising a monocrystalline semiconductor material. The active layer is made of a semiconductor material having a state of mechanical stress with respect to the support substrate, and the support substrate comprises, on its rear side, a silicon oxide layer, the thickness of the oxide layer being chosen to compensate bow induced by the mechanical stress between the active layer and the support substrate during cooling of the structure after the formation by epitaxy of at least a part of the active layer on the support substrate.

Semiconductor on insulator structure for a front side type imager

The invention relates to a front-side imager comprising in succession: —a semiconductor carrier substrate, a first electrically insulating separating layer, and a single-crystal semiconductor layer, called the active layer, comprising a matrix array of photodiodes, wherein the imager further comprises between the carrier substrate and the first electrically insulating layer: —a second electrically insulating separating layer, and —a second semiconductor or electrically conductive layer, called the intermediate layer, arranged between the second separating layer and the first separating layer, the second separating layer being thicker than the first separating layer.

Front-side-type image sensor

A method of manufacturing a substrate for a front-facing image sensor, comprises:—providing a donor substrate comprising a semiconductor layer to be transferred,—providing a semiconductor carrier substrate,—bonding the donor substrate to the carrier substrate, an electrically insulating layer being at the bonding interface,—transferring the semiconductor layer to the carrier substrate,—implanting gaseous ions in the carrier substrate via the transferred semiconductor layer and the electrically insulating layer, and—after the implantation, epitaxially growing an additional semiconductor layer on the transferred semiconductor layer.

Method for manufacturing a substrate for a front-facing image sensor

A method for manufacturing a CFET device comprises forming a substrate of the double semi-conductor on insulator type, successively comprising, from the base to the surface thereof: a carrier substrate, a first electrically insulating layer, a first single-crystal semiconductor layer, a second electrically insulating layer and a second single-crystal semiconductor layer. Slices are formed into the substrate to the first electrically insulating layer so as to form at least one fin (F). A channel of a first transistor is formed in the first semiconductor layer and a channel of a second transistor is formed opposite the first transistor in the second semiconductor layer. Formation of the substrate of the double semi-conductor on insulator type comprises: a first and a second step of transferring a layer and thermal processing at a temperature that is sufficiently high to smooth the first single-crystal semiconductor layer to a roughness lower than 0.1 nm RMS.

Method for manufacturing a CFET device

A substrate for a front-side type image sensor includes a supporting semiconductor substrate, an electrically insulating layer, and a silicon-germanium semiconductor layer, known as the active layer. The electrically insulating layer includes a stack of dielectric and metallic layers selected such that the reflectivity of the stack in a wavelength range of between 700 nm and 3 μm is greater than the reflectivity of a silicon oxide layer having a thickness equal to that of the stack. The substrate also comprises a silicon layer between the electrically insulating layer and the silicon-germanium active layer. The disclosure also relates to a method for the production of such a substrate.

Substrate for a front-side-type image sensor and method for producing such a substrate

A substrate for a front-side type image sensor includes a supporting semiconductor substrate, an electrically insulating layer, and a silicon-germanium semiconductor layer, known as the active layer. The electrically insulating layer includes a stack of dielectric and metallic layers selected such that the reflectivity of the stack in a wavelength range of between 700 nm and 3 &#x3bc;m is greater than the reflectivity of a silicon oxide layer having a thickness equal to that of the stack. The substrate also comprises a silicon layer between the electrically insulating layer and the silicon-germanium active layer. The disclosure also relates to a method for the production of such a substrate.

A method for manufacturing a structure comprising a first substrate comprising at least one electronic component likely to be damaged by a temperature higher than 400&#xb0; C. and a semiconductor layer extending on the first substrate comprises:

Method for manufacturing a structure for forming a tridimensional monolithic integrated circuit

Method of manufacturing a semiconductor on insulator type structure, notably for a front side type imager

A substrate for a front-side-type image sensor includes, successively, a supporting semiconductor substrate, an electrically insulating layer, and a semiconductor layer, known as the active layer. The active layer is an epitaxial layer of silicon-germanium having a germanium content of less than 10%. The disclosure also relates to a method for the production of such a substrate.

Substrate for front side type imager and method of manufacturing such a substrate

A method of forming a semiconductor structure includes introducing, at selected conditions, hydrogen and helium species (e.g., ions) in a temporary support to form a plane of weakness at a predetermined depth therein, and to define a superficial layer and a residual part of the temporary support; forming on the temporary support an interconnection layer; placing at least one semiconductor chip on the interconnection layer; assembling a stiffener on a back side of the at least one semiconductor chip; and providing thermal energy to the temporary support to detach the residual part and provide the semiconductor structure. The interconnection layer forms an interposer free from any through via.

Method for fabrication of a semiconductor structure including an interposer free from any through via

A method for determining a suitable implanting energy of at least two atomic species in a donor substrate to create a weakened zone defining a monocrystalline semiconductor layer to be transferred onto a receiver substrate, comprises the following steps: (i) forming a dielectric layer on at least one of the donor substrate and the receiver substrate; (ii) co-implanting the species in the donor substrate; (iii) bonding the donor substrate on the receiver substrate; (iv) detaching the donor substrate along the weakened zone to transfer the monocrystalline semiconductor layer and recover the remainder of the donor substrate; (v) inspecting the peripheral crown of the remainder of the donor substrate, or of the receiver substrate on which the monocrystalline semiconductor layer was transferred at step (iv); (vi) if the crown exhibits zones transferred onto the receiver substrate, determining the fact that the implanting energy at step (ii) is too high; (vii) if said the crown does not exhibit zones transferred onto the receiver substrate, determining the fact that the implanting energy at step (ii) is suitable.

Method for determining a suitable implanting energy in a donor substrate and process for fabricating a structure of semiconductor-on-insulator type

The present disclosure relates to a process for the manufacture of a high resistivity semiconductor substrate, comprising the following stages: providing a first substrate with an in-depth weakened layer; providing a second substrate with a layer of an oxide at the surface; attaching the first substrate to the second substrate so as to form a compound substrate comprising a layer of buried oxide; and cleaving the compound substrate at the level of the weakened layer. The process additionally comprises at least one stage of stabilization, in particular, a stabilization heat treatment, of the second substrate with the layer of oxide before the stage of cleaving at the level of the weakened layer.

Methods of forming semiconductor structures

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Vaulnaveys-le-Haut, France

Ludovic Ecarnot